活动简介

The 19th ACM/IEEE System Level Interconnect Prediction 2017 workshop will take place at the Austin Convention Center, Austin, TX on June 17, 2017. It will be co-located with 54th ACM/EDAC/IEEE Design Automation Conference, June 18-22, 2017.

征稿信息

重要日期

2017-03-11
摘要截稿日期
2017-04-01
初稿截稿日期
2017-04-22
初稿录用日期
2017-05-01
终稿截稿日期

征稿范围

  • Interconnect prediction and optimization at various IC and system design stages

  • System-level design for FPGAs, NOCs, reconfigurable systems

  • Design, analysis, and optimization of power and clock networks Interconnect reliability Interconnect topologies and fabrics of multi- and many-core architectures

  • Design-for-manufacturing (DFM) and yield techniques for interconnects

  • High speed chip-to-chip interconnect design

  • Design and analysis of chippackage interfaces

  • Power consumption of interconnects

  • 3D interconnect design and prediction

  • Emerging interconnect technologies

  • Applications of interconnects to social, genetic, and biological systems

  • Co-optimization of interconnect technology and chip design

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重要日期
  • 06月17日

    2017

    会议日期

  • 03月11日 2017

    摘要截稿日期

  • 04月01日 2017

    初稿截稿日期

  • 04月22日 2017

    初稿录用通知日期

  • 05月01日 2017

    终稿截稿日期

  • 06月17日 2017

    注册截止日期

主办单位
Association for Computing Machinery Special Interest Group on Design Automation - ACM SIGDA
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