Programming: Compilers, automatic code generation methods, cross assemblers, programming models, memory management, runtime management, object-oriented aspects, concurrent software.

Architectures: Multicore, Many-core, re-configurable platforms, memory management support, communication, protocols, real-time systems, SoCs and DSPs, heterogeneous architectures with HW accelerators and GPUs.

Design: Hardware specification, modeling, synthesis, low power simulation and analysis, reliability, variability compensation, thermal aware design, performance modeling, security issues.

Interconnection Networks: Electronic/Photonic/RF NoC architectures, Power and energy issues in NoCs, Application specific NoC design, Timing, Synchronous /asynchronous communication, RTOS support for NoCs, Modeling, simulation, NoC support for MCSoC, NoC for FPGAs and structured ASICs, NoC design tools, Photonic components, Virtual fabrications, Photonic circuits, Routing, Filter design.

Testing: Design-for-test, Test synthesis, Built-in-self-test, Embedded test for MCSoC.

Packaging Technologies: 3D VLSI packaging Technology, Vertical Interconnections in 3D Electronics, Periphery Interconnection between Stacked ICs, Area Interconnection between Stacked ICs, Thermal management schemes.

Real-Time Systems: real-time system design, RTOS, Compilation techniques, Memory/cache optimization, Interfacing and software issues, Distributed real-time systems, real-time kernels, Task scheduling, Multitasking design.

Benchmarks: Parallel Benchmarks, Workload characterization and evaluation

Applications: Bio-medical, Health-care, Computational biology, Internet of Things, Smart Mobility, Electric Vehicles, Aviation, Automobile, Military, and Consumer electronics.