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活动简介

The Pan Pac technical committee has finalized the program for the 2017 Pan Pacific Microelectronics Symposium at the Sheraton Poipu Kauai Resort. In addition to several inspiring keynotes, this program features ground-breaking research from global experts on advanced processes, design, embedding and Fan-Out packaging, interposer technology, materials, nanotechnology, quality, reliability, roadmaps and manufacturing strategies. The program for the 2017 Pan Pacific Microelectronics Symposium is finalized and now posted.

征稿信息

重要日期

2016-12-09
初稿截稿日期

征稿范围

  • 3D/Heterogeneous Integration

  • Emerging Technologies

  • Green Electronics

  • High Performance Low I/O

  • Internet of Things (IoT)

  • Material Advances

  • Nanotechnology

  • Photonics

  • Reliability and Quality

  • Trends, Roadmaps, and more

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重要日期
  • 会议日期

    02月06日

    2017

    02月09日

    2017

  • 12月09日 2016

    初稿截稿日期

  • 02月09日 2017

    注册截止日期

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