The Pan Pac technical committee has finalized the program for the 2017 Pan Pacific Microelectronics Symposium at the Sheraton Poipu Kauai Resort. In addition to several inspiring keynotes, this program features ground-breaking research from global experts on advanced processes, design, embedding and Fan-Out packaging, interposer technology, materials, nanotechnology, quality, reliability, roadmaps and manufacturing strategies. The program for the 2017 Pan Pacific Microelectronics Symposium is finalized and now posted.
3D/Heterogeneous Integration
Emerging Technologies
Green Electronics
High Performance Low I/O
Internet of Things (IoT)
Material Advances
Nanotechnology
Photonics
Reliability and Quality
Trends, Roadmaps, and more
02月06日
2017
02月09日
2017
初稿截稿日期
注册截止日期
2016年01月25日 美国 Kamuela, HI, USA
2016年泛太平洋微电子研讨会
留言