活动简介

APPLICATION FIELD

MOC2017 covers micro optics technologies used in optical communications, optical interconnect, optoelectronic devices, optical sensing and prosessing, displays and lighting.

The 22nd MICROOPTICS CONFERENCE covers microoptics technologies in the following major topical fields;

A. Optical Communications

Photonic networks, Optical routing, Advanced multiplexing, LAN, FTTH, etc.

B. Optical Interconnects

Chip/Board/System interconnects, Active optical cables, etc.

C. Optoelectronic Equipment

Optical storages, Laser and LED printers, Smart sensors, Advanced cameras, Advanced microscopes, etc.

D. Optical Sensing and Processing

Optics for image recognition, Physical measurements, Sensors and sensing systems, Security systems, Optical computing, Bio- and medical sensing, Tomography, etc.

E. Displays and Lighting

LCD, Laser/LED/EL displays, MEMS displays, 3D displays, Projection displays, Wearable displays, Flexible displays, Solid state lighting, Illuminations, Appearance design and control, etc.

F. New Applications and Emerging Technologies

Green photonics, Environmental and energy optics, Bio- and medical optics, Nano-photonics, Quantum systems, Next generation and intelligent microoptics, Car optics, Agricultural and fishery optics, etc.

征稿信息

重要日期

2017-06-16
摘要截稿日期
2017-07-29
初稿录用日期

征稿范围

The category of the conference covers the following subjects of microoptics;

1)Theory, Modeling, and Design

Aberrations, Dispersion, Beam optics, Guided-wave optics, Gradient-index optics, Diffractive optics, Photonic band, Slow light, Near-field optics, Nonlinear optics, Thermooptics, Plasmonics, Metal optics, Quantum optics/photonics, Biomimetic optics, Simulation and system design, etc.

2)Materials and Fabrication

Semiconductors, Crystals, Dielectric materials, Polymers, Liquid crystals, Nonlinear materials, Composite materials, Nano-materials, Transparent conductors, Magneto-optic materials, Spin-materials, Metamaterials, Nanocarbons, etc.
Micro- and nano-fabrication, Nano-imprint, Laser processing, Heterogeneous bonding, 3D printing, etc.

3)Measurement and Sensing

Spectroscopy, Interferometry, Reflectometry, Ultrafast measurement, 3D measurement, Quantum measurement, etc.

4)Passive Devices

Fibers, Waveguides, Multi/Demultiplexers, Add-drop multiplexers, Branching and mixing components, Photonic crystals, Filters, Microlenses, Diffractive optical elements, Isolators, Polarizers, etc.

5)Dynamic and Functional Devices

MEMS, Switches, Modulators, Tunable devices, Wavelength converters, Nonlinear optical devices, Deflectors, Optical buffers, etc.

6)EO/OE and Active Devices

Lasers, LEDs, VCSELs, Array lasers, Amplifiers, Photo detectors, Terahertz devices, Optical imaging sensors, Solar cells, Energy harvesting devices, etc.

7)Integration, Packaging, and Si photonics

Monolithic and hybrid integration, Mounting and packaging, Micro-assembly, Wafer-level assembly, 3D integration, etc.

8)System and Design Conception

留言
验证码 看不清楚,更换一张
全部留言
重要日期
  • 会议日期

    11月19日

    2017

    11月22日

    2017

  • 06月16日 2017

    摘要截稿日期

  • 07月29日 2017

    初稿录用通知日期

  • 11月22日 2017

    注册截止日期

主办单位
Institute of Industrial Science, The University of Tokyo
Research Center for Advanced Science and Technology, The University of Tokyo
IEEE Photonics Society
承办单位
Microoptics Group, JSAP
历届会议
移动端
在手机上打开
小程序
打开微信小程序
客服
扫码或点此咨询