APPLICATION FIELD
MOC2017 covers micro optics technologies used in optical communications, optical interconnect, optoelectronic devices, optical sensing and prosessing, displays and lighting.
The 22nd MICROOPTICS CONFERENCE covers microoptics technologies in the following major topical fields;
A. Optical Communications
Photonic networks, Optical routing, Advanced multiplexing, LAN, FTTH, etc.
B. Optical Interconnects
Chip/Board/System interconnects, Active optical cables, etc.
C. Optoelectronic Equipment
Optical storages, Laser and LED printers, Smart sensors, Advanced cameras, Advanced microscopes, etc.
D. Optical Sensing and Processing
Optics for image recognition, Physical measurements, Sensors and sensing systems, Security systems, Optical computing, Bio- and medical sensing, Tomography, etc.
E. Displays and Lighting
LCD, Laser/LED/EL displays, MEMS displays, 3D displays, Projection displays, Wearable displays, Flexible displays, Solid state lighting, Illuminations, Appearance design and control, etc.
F. New Applications and Emerging Technologies
Green photonics, Environmental and energy optics, Bio- and medical optics, Nano-photonics, Quantum systems, Next generation and intelligent microoptics, Car optics, Agricultural and fishery optics, etc.
The category of the conference covers the following subjects of microoptics;
1)Theory, Modeling, and Design
Aberrations, Dispersion, Beam optics, Guided-wave optics, Gradient-index optics, Diffractive optics, Photonic band, Slow light, Near-field optics, Nonlinear optics, Thermooptics, Plasmonics, Metal optics, Quantum optics/photonics, Biomimetic optics, Simulation and system design, etc.
2)Materials and Fabrication
Semiconductors, Crystals, Dielectric materials, Polymers, Liquid crystals, Nonlinear materials, Composite materials, Nano-materials, Transparent conductors, Magneto-optic materials, Spin-materials, Metamaterials, Nanocarbons, etc.
Micro- and nano-fabrication, Nano-imprint, Laser processing, Heterogeneous bonding, 3D printing, etc.
3)Measurement and Sensing
Spectroscopy, Interferometry, Reflectometry, Ultrafast measurement, 3D measurement, Quantum measurement, etc.
4)Passive Devices
Fibers, Waveguides, Multi/Demultiplexers, Add-drop multiplexers, Branching and mixing components, Photonic crystals, Filters, Microlenses, Diffractive optical elements, Isolators, Polarizers, etc.
5)Dynamic and Functional Devices
MEMS, Switches, Modulators, Tunable devices, Wavelength converters, Nonlinear optical devices, Deflectors, Optical buffers, etc.
6)EO/OE and Active Devices
Lasers, LEDs, VCSELs, Array lasers, Amplifiers, Photo detectors, Terahertz devices, Optical imaging sensors, Solar cells, Energy harvesting devices, etc.
7)Integration, Packaging, and Si photonics
Monolithic and hybrid integration, Mounting and packaging, Micro-assembly, Wafer-level assembly, 3D integration, etc.
8)System and Design Conception
11月19日
2017
11月22日
2017
摘要截稿日期
初稿录用通知日期
注册截止日期
2021年09月26日 日本 Hamamatsu
2021 26th Microoptics Conference2016年10月12日 美国 Berkeley,USA
第21届微光学大会2013年10月27日 日本
2013年第18届微光学会议
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