Symposium VI: Metrology, Reliability and Testing

Metrology

• Applications to ICs, thin film heads, systems-on-a-chip, and thin film

• Device manufacturing

• Breakthroughs and advancements in electron/Ion microscopy calibration and accuracy

• Critical dimension metrologies

• Defect detection, analysis, and control

• Limits of metrology and inspection systems

• Mask related metrology

• Measurement system modeling and simulation

• Metrology and inspection methodologies

• Overlay, registration, and alignment metrologies

• Process control, characterization, and yield enhancement

Reliability

• 3D IC reliability

• Back-End Reliability

• Front-End Reliability

• Memory

• MEMS reliability

• Middle of Line Reliability

• Nano-electronic device reliability

• Package/assembly reliability

• Product reliability and burn-in

• Reliability in designs and circuits

• Reliability in device and process

• Reliability in interconnects

• Reliability qualification strategies

Test

• 2.5D, 3D and SiP Test

• Analog/Mixed-Signal/RF Test

• ATE hardware and software

• ATPG, test synthesis

• Design-for-Test: chip, board, system

• Design and test for reliability

• Diagnostics

• Hardware Security

• IDDQ and current test

• Memory test

• Microprocessor Test

• Power issues in test

• System-on-Chip test

• System-in-Package test

• Test and design for manufacturability

• Test for nanometer technologies