Papers are solicited across the general field of electronic devices. Topics of interest include, but are not limited to:

• CMOS Processes, Devices and Integration:
  CMOS scaling; Silicon Nanowires;Simulation of Dual gate, Vertical Channel and Cylindrical Gate MOSFET/OTFTs;Advanced Memory Devices; Novel MOS device architectures;

• Emerging Non-CMOS Devices & Technologies:
  Emerging Electronic Device Materials (graphene, MoS2, etc.); Magnetic Devices;Novel MOS device architectures; III-V, and 2D Electronic Devices; New high-mobility channels (strained Si, Ge, SiGe);Nano-electro-mechanical Devices and Systems;High frequency digital and analog devices including THz; Novel non-CMOS materials, processes and devices, (nanotubes, nanowires and nanoparticles, including carbon, graphene, metal oxides, …) for electronic, optoelectronic, sensor & actuator applications;

• Device Modelling & Simulation: Modeling and simulation of nanomaterials, structures, and devices; Modelling of Solid State Devices;Modelling and Simulation of FinFETs, MOSFETs, CMOS, Tunnel-FETs; Modelling and Simulation p and n-Channel Organic Thin Film Transistors (OTFTs);Modelling and Simulation p and n-Polymer Thin Film Transistors (PTFTs);Modelling and Simulation Thin Film Transistors (TFTs);Modelling and Simulation Organic Novel Device Structures; Physics and Modeling of Submicron and Nanoscale Microelectronic and Optoelectronic Devices Including Processing, Measurement, and Performance evaluation; Analytical Models for Organic Devices;Modelling and Simulation of Organic Light Emitting Diodes (OLEDs); Modelling and Simulation of Organic Solar Cells;Mathematical Models of Novel Electronic Device Structures

• Device Characterization, Reliability & Yield: Front-end and back-end manufacturing processes; 3D integration and wafer-level packaging; Reliability of materials, processes and devices; Advanced interconnects; ESD, latch-up, soft errors, noise and mismatch behavior, hot carrier effects, bias temperature instabilities, and EMI; Defect monitoring and control; Metrology; Optimization of Device Performance Parameters;Terahertz Devices;Wide-bandgap Devices;Semiconductor Process Technologies;Nanostructures and devices for biomedical applications;Photovoltaics and Sensors System Design; 3D Systems and Packaging Technologies; Nanostructures for future generation solar cells;

• Devices with New material systems:
  Graphene and carbon nanotubes based materials and devices;Biological Devices; Organic/Polymer Electronics; Novel Optoelectronic Devices

• Devices for Low power applications:
  Energy Scavenging Devices; Materials and devices for energy and environmental applications;

• Low dimensional devices:
  Low dimensional Semiconductors: Growth & Applications;Quantum Devices;Quantum effect in Nanoscale Electronic and Optoelectronic Devices;Spin-based Devices;Computational Modeling at the Nanoscale;Fundamental and applications of nanotubes, nanowires, quantum dots and other low dimensional materials;

• Design and Simulation of Circuits with nanoscale devices:
  Modelling and Simulation of Novel Circuits;Modelling of Circuit Networks, Analogue and Digital Circuits; Mixed Mode Circuit Simulations; Applications of Numerical Methods to the Modeling and Simulation of Devices and Processes; Modelling and Simulations Device Circuit Co-design

• MEMS, Sensors & Display Technologies:Design, fabrication, modeling, reliability, packaging and smart systems integration of actuators (discrete SoC, SiP, or heterogenous 3D integration); MEMS, NEMS, optical, chemical or biological sensors; Display technologies; High-speed imagers; TFTs; Organic and flexible substrate electronics.

• Advanced & Emerging Memories: Novel memory cell concepts and architectures; Embedded and stand-alone memories; DRAM, FeRAM, MRAM, PCRAM, CBRAM, Flash, SONOS, nanocrystal memories; single and few electron memories; 3D systems integration; Organic memories; NEMS-based devices.