IEEE International Interconnect Technology Conference (IITC 2017) will be held in Hsinchu, Taiwan in May 16-18, 2017.
IITC 2017 is dedicated to technology advances in the fields such as: semiconductor processing, equipment development, advanced materials and interconnect systems.
IEEE International Interconnect Technology Conference (IITC 2017) brings together professionals and researchers. The conference seeks papers on all aspects of interconnects for device, circuit board and system-level applications. The deadline for submission of abstracts is February 1, 2017.
Additional conference Information will be available mid-October, 2016.
IEEE International Interconnect Technology Conference (IITC 2017) covers topics such as:
Process integration, via/trench patterning
Materials and Unit Processes
Reliability
Characterization
3D Integration and TSV
Novel Circuits and Systems for Signaling Networks-on-Chip
Packaging
Back-End Memories and MEMS
Novel Materials and Concepts
05月16日
2017
05月18日
2017
摘要截稿日期
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终稿截稿日期
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注册截止日期
2016年05月23日 美国
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2013 IEEE国际互连技术大会
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