会议简介

ECTC is the premier international conference sponsored by the IEEE Components, Packaging and Manufacturing Technology (CPMT) Society. ECTC papers comprise a wide spectrum of topics, including 3D packaging, electronic components, materials, assembly, interconnections, device and system packaging, optoelectronics, reliability, and simulation.

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重要日期
  • 会议日期

    06月01日

    2021

    06月04日

    2021

主办单位
IEEE
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