This symposium, the fourth in a biannual series, reflects the increasing interest in complex high-rate roll-to-roll (R2R) technologies as scalable pathways to fabricate devices with electronic or other advanced functionalities, including transistors, memories, physical and chemical sensors, photovoltaic cells, photo detectors, energy storage devices, displays, lighting and biomimetic surfaces. Submissions are encouraged for papers describing advanced concepts comprising additive (printing, coating, ALD, PVD, CVD), transformational (curing, annealing), subtractive (laser, molding, embossing, dry-phase), patterning (nanoimprint, optical and contact lithography), and hybrid manufacturing technologies as well as novel substrate handling and alignment concepts aiming for large-area and/or high-resolution patterning. Contributions on sheet-based or wafer-based manufacturing lines with a high degree of throughput and integration are also welcome.

This symposium is designed as a truly interdisciplinary forum for materials scientists, electronic and mechanical engineers to share the latest breakthroughs on the topic and to discuss novel process workflows and devices. A special focus is laid on hybrid manufacturing technologies, including in-line reliability assessment and quality control.