ICPT 2016 is hosted by CMP User's Group-China (CMPUG-CN). This conference will enhance the collaboration between industry and academia, manufacturers and clients, in response to the trend of rapid development of semiconductor industry. ICPT 2016 encourages the communication and exchange of ideas and opportunities.
We look forward to seeing you at ICPT 2016 and show you around the beautiful Friendship Hotel in Beijing city, China.
CMP (chemical mechanical planarization), as one of the most important processes in the semiconductor manufacturing, has been developed and improved continuously year after year. It has built a certain position in related industries, and is expanding in its applied area. From the user's point of view, technical demand is becoming higher and higher, and additional applications beyond the semiconductor area are increasing.
ICPT (International Conference on Planarization/CMP Technology), is a magnificent opportunity to have discussions on CMP technologies, including FEOL and BEOL CMP, Fundamentals of CMP, Polishing Processes, Consumables, Equipment, 3D/TSV, Metrology, Cleaning, Defect Control, Process Control, etc. The conference provides a place where every relevant researcher and engineer can get together to discuss openly and exchange information widely.
Abstracts of original work are requested on the following topics:
Front end and Back end CMP
Equipment and metrology
Process integration and control
Emerging technologies in CMP
Defects and Post CMP cleaning
CMP consumables
Reliability issues
3D Ics/TSV applications
CMP fundamentals, modeling and simulation CMP alternative technologies
CMP for MEMS
CMP for Green devices
10月17日
2016
10月19日
2016
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