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活动简介

ICPT 2016 is hosted by CMP User's Group-China (CMPUG-CN). This conference will enhance the collaboration between industry and academia, manufacturers and clients, in response to the trend of rapid development of semiconductor industry. ICPT 2016 encourages the communication and exchange of ideas and opportunities.

We look forward to seeing you at ICPT 2016 and show you around the beautiful Friendship Hotel in Beijing city, China.

CMP (chemical mechanical planarization), as one of the most important processes in the semiconductor manufacturing, has been developed and improved continuously year after year. It has built a certain position in related industries, and is expanding in its applied area. From the user's point of view, technical demand is becoming higher and higher, and additional applications beyond the semiconductor area are increasing.

ICPT (International Conference on Planarization/CMP Technology), is a magnificent opportunity to have discussions on CMP technologies, including FEOL and BEOL CMP, Fundamentals of CMP, Polishing Processes, Consumables, Equipment, 3D/TSV, Metrology, Cleaning, Defect Control, Process Control, etc. The conference provides a place where every relevant researcher and engineer can get together to discuss openly and exchange information widely.

征稿信息

重要日期

2016-05-15
摘要截稿日期

征稿范围

Abstracts of original work are requested on the following topics:

  • Front end and Back end CMP 

  • Equipment and metrology

  • Process integration and control 

  • Emerging technologies in CMP

  • Defects and Post CMP cleaning 

  • CMP consumables

  • Reliability issues 

  • 3D Ics/TSV applications

  • CMP fundamentals, modeling and simulation CMP alternative technologies

  • CMP for MEMS

  • CMP for Green devices

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重要日期
  • 会议日期

    10月17日

    2016

    10月19日

    2016

  • 05月15日 2016

    摘要截稿日期

  • 10月19日 2016

    注册截止日期

主办单位
Tongji University
承办单位
China Semiconductor Industry Association
Technical Committee of Tribology in Micro/Nano Manufacturing
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