Change is the only constant in the Failure Analysis world. There is always the Next Generation technology to be understood, the Next Generation material to be learned, the Next Generation equipment to be mastered. In this changing world, the Next Generation constantly challenges the knowledge of today's engineers. The International Symposium for Testing and Failure Analysis (ISTFA) answers this challenge. At ISTFA, you can learn from the experts, network with people who can support your work, explore the latest apps and tools for the failure analysis lab, and become a knowable presenter yourself, teaching others. ISTFA offers opportunities for all levels of proficiency, from the Next Generation of engineers, who seek to boost their starting career, to expert engineers, who seek insight into Next Generation challenges already today.
Now accepting papers for the technical program of the 42nd International Symposium for Testing and Failure Analysis (ISTFA). Paper selection is based entirely on information submitted in abstracts and will be evaluated on novelty, completeness, quality, and benefit to the FA community. Submit your minimum two-page abstract including images, figures, and references.
Deadline for Abstract Submission: Extended to April 25, 2016.
3D Devices Failure Analysis
Detecting and Preventing Counterfeit Microelectronics
Case Studies and FA Process
Device FA
Emerging FA Techniques and Concepts
FIB Circuit Analysis and Edit
FIB Sample Preparation
Packaging and Assembly Level FA
Board and System Level FA
Reverse Engineering
Fault Isolation
Microscopy
Sample Preparation and Device Deprocessing
Scanning Probe Analysis
Nanoprobing and Electrical Characterization
11月06日
2016
11月10日
2016
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