We are proud to announce a great support from Singapore University Of Technology and Design (SUTD) for EPTC 2016 Introduce Institution Visit. Starting this year we are introducing an EPTC’s Institution Visit as part of the ETPC Programs.
Advanced Packaging: Flip-chip and wire-bond packaging, embedded passives and actives on substrates, 3D System in Packaging, etc.
TSV/Wafer Level Packaging: Wafer level packaging ( Fan in / Fan out ), embedded chip packaging, 2.5D/3D integration, TSV, Silicon & Glass interposer, RDL, bumping technologies, etc.
Interconnection Technologies: Au/Ag/Cu/Al Wire-bond / Wedge bond technology, Flip-chip & Cu pillar technology, solder alternatives (ICP, ACP, ACF, NCP, ICA), Cu to Cu, Wafer level bonding & die attachment (Pb-free) etc.
Emerging Technologies: Packaging technologies for MEMS, biomedical, optoelectronics, Internet of things, photo voltaic, printed electronics, wearable electronics, Photonics, LED, etc.
Materials and Substrates/Leadframes: Including all that polymer and solder materials, and Substrates / Interposer / Leadframes / PCB etc.
Processes and Automation/Equipments: new process development as well as equipment automation development.
Electrical Modeling & Simulations: Power plane modeling, signal integrity analysis of substrate/package.
Mechanical Modeling & Simulations: Thermo-mechanical, moisture, fracture, fatigue, vibration, Shock and drop impact modeling, Chip-package interaction, etc.
Thermal Characterization & Cooling Solutions: Thermal modeling and simulation, component, system and product level thermal management and characterization
Quality & Reliability: Component, board, system and product level reliability assessment, Interfacial adhesion, accelerated testing, failure characterization, etc.
Wafer/Package level & TSV Testing and Characterization: High-speed test architectures and systems design, 2.5D & 3D test methodologies, probe card design, package-test interaction, high-throughput
11月30日
2016
12月03日
2016
初稿录用通知日期
注册截止日期
2017年12月06日 新加坡
2017 IEEE 19th Electronics Packaging Technology Conference2014年12月03日 新加坡
2014年IEEE第16届电子封装技术大会
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