DTIP2016 will be the 18th edition of the Symposium on Design, Test, Integration & Packaging of MEMS and MOEMS. This unique single-meeting event brings together participants interested in MEMS/MOEMS processing and those interested in design tools and methods to facilitate the design of MEMS/MOEMS. All aspects including design, modeling, testing, micro-machining, integration and packaging of structures, devices and systems are addressed in two main Conferences, Special Sessions and Invited Talks. Selected papers will appear in IEEE Xplore and extended papers would be submitted in a special issue of an indexed journal.
05月30日
2016
06月02日
2016
注册截止日期
2017年05月29日 法国 Bordeaux
2017 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS2014年04月01日 法国
2014 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS2013年04月16日 西班牙
2013 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS
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