2016 Symposia on VLSI Technology and Circuits

活动简介

Professors Shoji Tanaka and Walter Kosonocky, founders of the Symposia, first organized the VLSI Technology Symposium in 1981 with the hope of offering an opportunity for world’s top technologists to engage in an open exchange of ideas on what was quickly becoming a revolution in the world’s industrial capability. Since then, the Symposium has been held annually and has grown to be an important and valuable event for people working in the VLSI business. The presentation of high-quality papers has made it possible for attendees to learn about new directions in the development of VLSI technology. The friendly atmosphere has made this an enjoyable learning experience.

The Symposium on VLSI Technology has alternated each year between sites in US and Japan. In 1987, the first Symposium on VLSI Circuits was held in conjunction with the Technology Symposium in recognition of the growing interest to provide the same small but intense and open forum for discussing circuit and system implementations. Since then, this annual meeting has increased its value over the past 26 years. We are confident that so many new technologies and circuits were introduced in the past Symposia and thus have contributed to the prosperity of the world. Its sponsors continue to be the IEEE Electron Devices Society and Solid-State Circuits Society, and the Japan Society of Applied Physics in cooperation with the Institute of Electronics, Information and Communication Engineers.

For many reasons, these meetings have remained linked for the past years to provide opportunities for technology people and circuit and system designers to interact with each other. These interactions are augmented with short courses, invited speakers and several evening rump sessions. In recognition of the efforts of organizers, authors and participants to make the Symposia successful, there is ample banquet and entertainment prearranged.

The 2015 meeting was held in Kyoto, Japan. This year it will be returning to the Hilton Hawaiian Village in Honolulu, Hawaii in June of 2016.

征稿信息

征稿范围

IoT Systems and Technologies including ultra-low power technologies; heterogeneous integration; sensors, display, connectivity; power management; digital/analog, microcontrollers and application processors.
Stand-Alone and Embedded Memories technology and reliability for DRAM, SRAM, Non-Volatile, Emerging Memories.
CMOS Technology, Microprocessors and SoCs including scaling, VLSI manufacturing concepts, and yield optimization.
RF / Analog / Digital Technologies for mixed-signal SoC; RF front end; analog, mixed-signal, I/O, high-voltage, imaging, MEMS, integrated sensors.
Process and Material Technologies including advanced transistor process and architecture, modeling and reliability; alternate channel; advanced lithography, high-density patterning; SOI and III-V technologies; photonics; local interconnects and Cu/optical interconnects scaling.
Packaging Technologies and System-in-Package (SiP) including through-silicon-vias (TSVs) and 3D-system integration.
Photonics Technology and Beyond CMOS Devices
Digital circuits and techniques for standalone and embedded processors
Memory circuits, architectures and interfaces for volatile and non-volatile memories, including emerging technologies
Clock generation and distribution for high-frequency digital and mixed-signal applications
Analog and mixed-signal circuits, including amplifiers, filters, and data converters
Wireline receivers and transmitters, including circuits for inter-chip and long-reach applications
Wireless receivers and transmitters, and circuits for WAN, LAN, PAN, BAN inter-chip. and mm-wave applications
Power management circuits, including those for battery management, voltage regulation, and energy harvesting
Application-oriented circuits and VLSI systems, imagers, displays, sensors and biomedical and healthcare applications