We solicit technical papers in the following and similar fields of research:
● Materials: Epitaxy, strain engineering, characterization, stability issues, smart materials.
● Technologies: Nano-technologies incl. CNT, nanowire and graphene; Si-based heterostructures, advanced RF CMOS and Si/SiGe BiCMOS incl. through-Si vias integration; RFMEMS and micromachining for improved RF performance and integrated antennas, RFMEMS/RFIC integration; advanced packaging.
● Devices: Physics, optimization, and scaling limits of SiGe HBTs, RF CMOS, strained-Si CMOS, Si-Ge MOSFETs and MODFETs, mm-wave diodes; advanced passive devices, integrated antennas; nanodevices for micro-/millimeter-wave applications.
● Circuits: Microwave, mm-wave, THz and mixed signal building blocks and multi-functional ICs, integrated transceivers, high-speed DAC and ADC, RFICs, reconfigurable micro-/mm-wave ICs.
● Si photonics: Si-based photonic components, integration with electronic circuits.
● Applications: System-on-Chip (SoC) and System-in-Package (SiP),  Flexible electronics;  2-D electronics; ultra-wideband (UWB) frontends, wireless sensor networks, intelligent antennas and antenna rray solutions, emerging telecom (e.g. 60 GHz WLAN, E-band) and sensor systems (automotive, 
security, health monitoring); radio over fiber.
● Yield, Reliability and Signal Integrity: Yield impact of nanoscaling and heterogeneous integration;robustness and reliability of ultra-scaled technologies; substrate noise, on-chip crosstalk; thermal 
management.
● Measurement and Modeling: Multi-physics modeling, EM simulation of complex RFICs, robustmeasurement and de-embedding, built-in self-test, self-calibration, high-throughput RFIC testing.