It is our honour and pleasure to invite you to participate in the forthcoming International Conference on the Properties and Applications of Dielectric Materials (ICPADM). The ICPADM is fully sponsored by the IEEE Dielectrics and Electrical Insulation Society. This triennial Conference, established since 1985, is the premier insulation and dielectric materials forum for Asia. Recent ICPADM venues have included India, China, Indonesia, and Japan. The 2015 Conference will be the eleventh ICPADM and will be held at the University of New South Wales (UNSW) in Sydney, Australia, from July 19-22, 2015. The ICPADM is a conference combining fundamental research and application practice in dielectrics covering the basic dielectric physics and the general areas of electrical insulation in power system equipment and components, monitoring and diagnosis of insulation degradation, insulation for EHV AC and HVDC systems, ageing and life expectancy of insulation, dielectric phenomena and applications, partial discharges, electrical and water treeing and surface tracking, electrical conduction and breakdown in dielectrics, surface and interfacial phenomena, nano-technology and nano-dielectrics, space charge and its effects, new and functional dielectrics, dielectric materials for electronics and photonics, eco-friendly dielectrics, bio-dielectrics, dielectrics for superconducting applications, new diagnostic applications, modelling and simulation of insulation systems, etc.