The main purpose of this new Workshop is to bring together researchers in the field of power electronics components and packaging technologies to rapidly promote the development and commercialization of high-density and high-efficiency power converters. Papers ranging from material technologies to power converters are sought that address important challenges and present solutions to reduce the cost and size of power converters with the highest energy conversion efficiency. Of particular interest are packaging and thermal management of advanced semiconductor devices and power switch modules, integrated gate/base drivers, high-frequency magnetics, and high-temperature capacitors.