One of the technology trends of the electronics industry is the rapid development and ever-increasing application of advanced simulation methodologies and tools. For the leading global companies, simulation is becoming a daily practice, a standard tool, and an important competitive edge to achieve competitive product and/or process development. Thermal, thermo-mechanical and mechanical simulations have significant impact on the business profitability of electronics industries. On the other hand, the fascinating development of the electronics industry has also formulated many challenges and impulse for the further development of simulation methodologies and tools. As the only international conference specially dedicated to thermal, mechanical and multiphysics simulation and experiments in microelectronics and microsystems, EuroSimE was initiated in 2000 with major sponsorship from the European Community. The 16th in the series, EuroSimE 2015 aims to: promote further development and application of simulation methodologies and tools for the electronics industry, improve communication and exchange information between methodology & tool-developers and industry users, strengthen co-operation between industry, universities, and research institutes.
04月19日
2015
04月23日
2015
注册截止日期
2024年04月07日 意大利 Catania
2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems2018年04月15日 法国
2018 19th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems2017年04月02日 德国 Dresden
2017 18th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems2016年04月17日 法国 Montpellier, France
2016年第17届热,机械和多物理场仿真与微电子和微系统实验国际会议
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