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活动简介

The objective of the HiTEN Conference is to have a unique forum that brings together researchers and practitioners in academia and industry from all over the world. All styles of practical high temperature electronics design and implementation approaches are encouraged, along with a variety of high temperature application areas. Today the main semiconductor focus of HITEN is silicon and silicon on insulator (SOI). Although, HITEN is not simply a semiconductor focused network. HITEN provides a conduit for the exchange and dissemination of information on all aspects of high temperature electronics. It is a global network with users, suppliers, developers and fundamental researchers dealing in all aspects of High Temperature Electronics.

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重要日期

2015-01-30
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征稿范围

Abstracts are being requested in the following areas: Applications in the Aerospace, Automotive, Oil & Gas, and Geothermal Industries Devices and applications Novel devices ASICs for high temperature applications Memories Passive components Power devices Semiconductor materials Contacts and metallizations Materials Packaging and inter connects Sealants, adhesives, solders Reliability and failure mechanisms Lifetime predictions Accelerated life testing Testing at high temperatures
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重要日期
  • 会议日期

    07月06日

    2015

    07月08日

    2015

  • 01月30日 2015

    摘要截稿日期

  • 07月08日 2015

    注册截止日期

主办单位
International Microelectronics Assembly and Packaging Society (IMAPS)
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