The 48th International Symposium on Microelectronics is being organized by the International Microelectronics Assembly and Packaging Society (IMAPS). The IMAPS 2015 Technical Committee seeks original papers that present progress on technologies throughout the entire microelectronics/packaging supply chain. The Symposium will feature 5 technical tracks that span the three days of sessions on: PACKAGING THE INTERNET OF THINGS: LEADING THE RACE FROM TECHNOLOGY TO SYSTEM; INTERPOSERS & 2.5/3D PACKAGING; ADVANCED PACKAGING AND ENABLING TECHNOLOGIES; ADVANCED MATERIALS & PROCESSES; MODELING, DESIGN, TEST & RELIABILITY; as well as the Interactive University Poster Session. Technical sessions are being planned for these tracks, and abstracts will be considered on the topics listed below. Abstracts are rated by the technical committee members and are selected into the sessions by the session chairs appointed by the technical committee. Authors should identify their preferred session (topical area) when submitting their abstracts. Abstracts should highlight the major contributions of the work in one or more of these areas. All abstracts submitted must represent original, previously unpublished work.