Sessions and Keywords 1. Advanced Packaging Wafer Level Packaging, System Integration, PoP, MCM, System on Package, Novel Assembly Technologies 2. Substrate and Interposers Laminates, Interposers, Fine Pitch, Build-up Substrates, Flexible Printed Circuits, Embedded, Conductive Paste, Thin Core, Coreless, Low CTE 3. Interconnection Bump Formation, Chip-Package Interaction, Low k, Leadframe, Test of First- and Second- Level Interconnections, Interconnections for 3D Integration, Interconnections in Substrates, PCBs and Systems 4. 3DIC Packaging TSV, Via Formation and Filling, 2.5D, Wafer Thining, Silicon Stacking, Chip on Chip, Chip on Wafer, Wafer on Wafer, Wide Bus, Wireless Interconnection, Temporary Bonding/De-Bonding 5. Design, Modeling, and Reliability Signal and Power Integrity, High Speed Board Design, Mechanical Design and Reliability, Failure Analysis, Fracture and Warpage in Packages, Testing, Evaluation, TCAD, 3DIC Design 6. Thermal Management Advanced Cooling Modules, Heat Pipes, Heat Sinks, Fans and Blowers, Thermal Interface Materials, Thermal Measurements, Micro and Nano Scale Heat Transfer, Thermal Issues in Devices 7. Materials and Process Novel Materials and Processing, Dielectrics, Emerging Materials and Processes for 3D, Thin Films, Underfills, Assembly Challenges and Solutions, Wefer Thinning, Plating, Equipment, Encapsulation 8. Printed Electronics Inkjet, Screen Printing, Conductive Wiring, Insulation, Printed Organic TFTs, Device Applications 9. N-MEMS NEMS-MEMS/Sensor Devices, MOEMS, Assembly and Packaging, Nano Technology, Nano Imprint Lithography, Organic Semiconductors, Wireless Sensor Networks 10. Optoelectronics Active Optical Cable, Photonic Devices, Optical Fibers, Waveguides, Optical Interconnects, Transceivers, Connectors, LD/PD, LED, OE/EO, TOSA/ROSA, WDM, Optical Wiring Boards 11. Self-Organization/Self-Assembly Biomimetics, Nature-Guided, Bottom-up Manufacturing, Smart Materials and Devices, Spontaneous Ordering/Patterning/Structuring, Self-Bonding/Debonding, Repairable, Self-Healing, Novel Micro/Nano Processing 12. Medical Devices Invasive, Low Invasive, Non Invasive, In Vitro, BAN, Cure, Treatment, Diagnosis, Screening, POC, Healthcare 13. Power Devices Power Electronics, Power Devices, Automotive Electronics, ECUs, Sensors, Lead Free Solder, Wire Harness, Energy Harvesting 14. RF RFID, High Frequency Devices, Packaging, Filters, EMI, EMC, Antennas, Wireless Power Transmission 15. Others Market Trends, Environmentally Conscious Products and Processes, Cost Analyses