The first international symposium for Planarization/CMP Technology was held at PacRim2004 in Tokyo, Japan. The 11th ICPT2014 will be held in Kobe, Japan on November 19-21, 2014. This will be the third time here in Japan since the first time, at PacRim2004 in Tokyo and the second, at ICPT2009 in Fukuoka. Last year we had celebrated the 10th anniversary of ICPT conference in Hsinchu, Taiwan. This ICPT2014 will mark the beginning of a new chapter for the next decade. CMP, one of the most important processes in the semiconductor devices manufacturing, has been developed and improved continuously year after year, has built a certain position in related industries, and is expanding in its applied area. From the user's point of view, technical demand is becoming higher and higher, and additional applications beyond the semiconductor area are increasing. ICPT as an international symposium for Planarization/CMP is a magnificent opportunity to have discussions on technologies including FEOL and BEOL CMP, 3D/TSV, Fundamentals of CMP, Polishing Processes, Consumables, Equipment, Green Devices, New Applications, Metrology, Cleaning, Defect Control, Process Control, CMP Alternatives, SiC, GaN, Sapphire and Diamond. The conference provides a place where every relevant researcher and engineer can get together to discuss openly and exchange information widely. Enthusiastic presentations and discussions are expected to be on an equal footing, flat like the surface of wafer, no matter what country, organization/position and technology area he/she belongs to. The city of Kobe, one of three major passenger port towns in Japan, has many buildings with western-style architecture, a townscape and an exotic mood. Kobe is a fascinating city even for Japanese people. Japan will welcome you all with the heart of "O･Mo･Te･Na･Shi" (expecting nothing in return), hospitality, reception, and entertainment services from our heart, as sensitive and smooth as the semiconductor rule.