征稿范围
Authors are invited to submit papers describing new technical contributions related to the broad area of electrical performance of high-performance interconnect systems, covering:
Emerging and advanced issues,
New design techniques and innovative architectures
Novel CAD concepts, methodologies and algorithms for modeling, simulation and optimization,
with emphasis on:
System-level, board-level and on-chip interconnects
High-speed channels, links, backplanes, serial and parallel interconnects, SerDes
Low power mobile and personal applications
Multiconductor transmission lines
Memory and DDR interfaces
Jitter and noise management
Signal and thermal integrity
Power integrity and power distribution networks (PDNs)
Electronic packages and microsystems
3D interconnects, 3D packages, TSVs and MCMs
Nano interconnects and nano structures
RF/microwave packaging structures, RFICs, mixed signal modules and wireless switches
Package-chip co-design
Electromagnetic (EM) and EM interference modeling, simulation algorithms, tools and flows
Macromodeling and model order reduction as it applies to electrical analysis
Advanced and parallel CAD techniques for signal, power and thermal integrity analysis
Measurement and data analysis techniques for system-level and on-chip structures.
留言