The Global Interposer Technology 2013 Workshop (GIT 2013), sponsored by IEEE, is intended to stimulate development of most advanced semiconductor and systems packaging technologies, comparing and contrasting a wide variety of interposer technologies such as silicon, organic, and glass. GIT 2013 brings together academic and industry researchers from end-users, device manufacturers, interposer substrate manufacturers and supply chain companies from around the world. Such interposer technologies have many applications including packaging of ICs in 2D, 2.5D and 3D from smart phones, automotive, and high performance systems.