The 3rd International Symposium on Integrated Circuit Design and Integrated Systems (ICDIS 2026) will be held in Inner Mongolia, China on August 1-3, 2026 in a hybrid format.
The conference will provide a platform for all industry insiders and scholars from all over the world, where researchers, engineers and students from industry, universities and government institutions will present their latest work and discuss many applications of Integrated circuit design and integrated systems. Looking forward to seeing you at ICDIS 2026!
General Chair
Mário F. S. Ferreira, University of Aveiro, Portugal
Esteban Tlelo-Cuautle, Instituto Nacional de Astrofísica, Óptica y Electrónica, Mexico
Technical Committee Chair
Bimal K. Bose, The University of Tennessee, Knoxville, USA
Ljiljana Trajkovic, Simon Fraser University, Canada
Yang Yue, Xi'an Jiaotong University, China
Technical Committee Member
Adil ADAM, Zaytoonah International University, Aleppo, Syria
Fanyi Meng, Tianjin University, China
Fei Yuan, Toronto Metropolitan University, Canada
Frank Werner, Otto-von-Guericke-Universität Magdeburg, Germany
Guennadi A. Kouzaev, Norwegian University of Science and Technology, Norway
Hao Lu, Xidian University, China
Ioannis Kouretas, University of Patras, Greece
Jose P. Calipayan, North Eastern Mindanao State University, Philippines
Kamran Dawood, Astor Enerji, Turkey
Luigi Fortuna, University of Catania, Italy
Mehdi Gheisari, Mehdi Gheisari Islamic Azad University, Iran
Mihaela Popescu, University of Craiova, Romania
Mohamad Sawan, Westlake University, China
Mohan Lal Kolhe, University of Agder, Norway
Muhammad Junaid, China University of Mining and Technology, China
Mukul Kumar, National Taiwan University, Taiwan
Paras Pandey, Amazon Web Services Fintech, USA
Patrick Siarry, Université Paris-Est Créteil, France
Peter Sachsenmeier, Hankou University, China
Prashant Kasambe, Saradr Patel Institute of Technology, India
Prosen Kirtonia, University of Louisiana at Lafayette, USA
Qingrui Meng, Qualcomm, USA
Ridvan Umaz, Bitlis Eren University, Turkey
Sadegh Vaez-Zadeh, University of Tehran, Iran
Samia Moulebhar, University Abd El Hamid Ibn Badis, Aleppo, Algeria
Saurabh Kotiyal, Intel Corporation, USA
Smain Femmam, UHA University, France
Sourabh Jhawar, Apptad, USA
Taha Elwi, Al-Mammon University College, Iraq
Tee Hui Teo, Singapore University of Technology and Design, Singapore
Yoshiaki Daimon Hagiwara, Sojo University, Japan
Sponsor
University of Campinas
Sanya Global Energy Research Institute
The Technical Committee of the 3rd International Symposium on Integrated Circuit Design and Integrated Systems (ICDIS 2026) invites the submission of original research papers in the fields of integrated circuit design and integrated systems. Each submission is anonymously reviewed by an average of three independent reviewers, to ensure the final high standard and quality of submitted papers. Accepted papers will be presented in either oral or poster at the conference.
Contributions are sought in the following areas:
Analog, Digital, Mixed, and RF Circuits Design
Low Power Tools and Designs Techniques
Photonic Integrated Circuits (PIC) Design and Optimization
CMOS-Compatible Photonic Devices and Applications CMOS
Photonic Integrated Chips and Photonic Integrated Technology
Combinatorial Logic Gate CMOS
Memory and Array Structure Design
VLSI Design
Advanced Materials for Photonic and Optoelectronic Devices
Silicon / Germanium Devices and Device Physics
Modeling and Simulation of Organic Semiconductor Devices
Test, Fault Tolerance, Reliability and Modelling
Interconnect, Low K, High K and Other Process Technologies
Integrated Circuits CAD, DFM
Signal Processing Techniques for Hybrid Photonic-Electronic Systems
Highly Integrated Front-end Circuits and Devices
Integrated Circuits for Optical Communications
Physical Design of Optoelectronic Integration Circuits and systems
Devices and Circuits for Wireless Systems
Devices, Hardware and Methods for Bio-Inspired and Neuromorphic Computing
Manufacturing, Processing, Packaging and Testing Technology of Optoelectronic Integration and Devices
Electronic Design Automation (EDA)
Data Path in Digital Processor Architecture
Embedded/Multiprocessor Systems
Hardware-Software Co-Design and Co-Verification
All submissions must be in English with a varying length from 4 to 8 pages including figures and references, adhere to the template format in the conference website.
Please submit your paper via email to icdis@acamail.org.
Authors must complete their submissions before the designated deadlines. Late submissions will not be considered. The initial and final submissions must be in editable format. Hardcopy is not accepted.
08月01日
2026
08月03日
2026
初稿截稿日期
2022年08月24日 中国 Shenzhen
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