活动简介

The 3rd International Symposium on Integrated Circuit Design and Integrated Systems (ICDIS 2026) will be held in Inner Mongolia, China on August 1-3, 2026 in a hybrid format.

The conference will provide a platform for all industry insiders and scholars from all over the world, where researchers, engineers and students from industry, universities and government institutions will present their latest work and discuss many applications of Integrated circuit design and integrated systems. Looking forward to seeing you at ICDIS 2026!

组委会

General Chair

Mário F. S. Ferreira, University of Aveiro, Portugal

Esteban Tlelo-Cuautle, Instituto Nacional de Astrofísica, Óptica y Electrónica, Mexico

 

Technical Committee Chair

Bimal K. Bose, The University of Tennessee, Knoxville, USA

Ljiljana Trajkovic, Simon Fraser University, Canada

Yang Yue, Xi'an Jiaotong University, China

 

Technical Committee Member

Adil ADAM, Zaytoonah International University, Aleppo, Syria

Fanyi Meng, Tianjin University, China

Fei Yuan, Toronto Metropolitan University, Canada

Frank Werner, Otto-von-Guericke-Universität Magdeburg, Germany

Guennadi A. Kouzaev, Norwegian University of Science and Technology, Norway

Hao Lu, Xidian University, China

Ioannis Kouretas, University of Patras, Greece

Jose P. Calipayan, North Eastern Mindanao State University, Philippines

Kamran Dawood, Astor Enerji, Turkey

Luigi Fortuna, University of Catania, Italy

Mehdi Gheisari, Mehdi Gheisari Islamic Azad University, Iran

Mihaela Popescu, University of Craiova, Romania

Mohamad Sawan, Westlake University, China

Mohan Lal Kolhe, University of Agder, Norway

Muhammad Junaid, China University of Mining and Technology, China

Mukul Kumar, National Taiwan University, Taiwan

Paras Pandey, Amazon Web Services Fintech, USA

Patrick Siarry, Université Paris-Est Créteil, France

Peter Sachsenmeier, Hankou University, China

Prashant Kasambe, Saradr Patel Institute of Technology, India

Prosen Kirtonia, University of Louisiana at Lafayette, USA

Qingrui Meng, Qualcomm, USA

Ridvan Umaz, Bitlis Eren University, Turkey

Sadegh Vaez-Zadeh, University of Tehran, Iran

Samia Moulebhar, University Abd El Hamid Ibn Badis, Aleppo, Algeria

Saurabh Kotiyal, Intel Corporation, USA

Smain Femmam, UHA University, France

Sourabh Jhawar, Apptad, USA

Taha Elwi, Al-Mammon University College, Iraq

Tee Hui Teo, Singapore University of Technology and Design, Singapore

Yoshiaki Daimon Hagiwara, Sojo University, Japan

 

Sponsor

University of Campinas

Sanya Global Energy Research Institute

征稿信息

重要日期

2026-06-15
初稿截稿日期

The Technical Committee of the 3rd International Symposium on Integrated Circuit Design and Integrated Systems (ICDIS 2026) invites the submission of original research papers in the fields of integrated circuit design and integrated systems. Each submission is anonymously reviewed by an average of three independent reviewers, to ensure the final high standard and quality of submitted papers. Accepted papers will be presented in either oral or poster at the conference.

征稿范围

Contributions are sought in the following areas:

Analog, Digital, Mixed, and RF Circuits Design

Low Power Tools and Designs Techniques

Photonic Integrated Circuits (PIC) Design and Optimization

CMOS-Compatible Photonic Devices and Applications CMOS

Photonic Integrated Chips and Photonic Integrated Technology

Combinatorial Logic Gate CMOS

Memory and Array Structure Design

VLSI Design

Advanced Materials for Photonic and Optoelectronic Devices

Silicon / Germanium Devices and Device Physics

Modeling and Simulation of Organic Semiconductor Devices

Test, Fault Tolerance, Reliability and Modelling

Interconnect, Low K, High K and Other Process Technologies

Integrated Circuits CAD, DFM

Signal Processing Techniques for Hybrid Photonic-Electronic Systems

Highly Integrated Front-end Circuits and Devices

Integrated Circuits for Optical Communications

Physical Design of Optoelectronic Integration Circuits and systems

Devices and Circuits for Wireless Systems

Devices, Hardware and Methods for Bio-Inspired and Neuromorphic Computing

Manufacturing, Processing, Packaging and Testing Technology of Optoelectronic Integration and Devices

Electronic Design Automation (EDA)

Data Path in Digital Processor Architecture

Embedded/Multiprocessor Systems

Hardware-Software Co-Design and Co-Verification

 

作者指南

All submissions must be in English with a varying length from 4 to 8 pages including figures and references, adhere to the template format in the conference website.

Please submit your paper via email to icdis@acamail.org.

Authors must complete their submissions before the designated deadlines. Late submissions will not be considered. The initial and final submissions must be in editable format. Hardcopy is not accepted.

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重要日期
  • 会议日期

    08月01日

    2026

    08月03日

    2026

  • 06月15日 2026

    初稿截稿日期

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