2024 IEEE 10th IEEE International Conference on High Performance and Smart Computing (HPSC)

活动简介

High performance and smart computing (HPSC) is getting more and more attention due to the rapid development of computing and communication techniques. From national governments and industry players to consumer level demand, interest in high performance and smart computing has emerged from many different stakeholders. As a promising technology, high performance computing is playing an important role not only in traditional computer science domain but also in new branches such as Internet of Things, unmanned vehicles, and topics in artificial intelligent. Smart computing, as another significant aspect, provides solutions for complicated computing problems.

组委会

General Chairs

Cheng Zhang, Ibaraki University, Japan

Meikang Qiu, Dakota State University, USA

Program Chairs

Hongjun Dai, Shandong University, China

Xiaofu He, Columbia University, USA

Yang Xiang, Deakin University, Australia

Industry Chair

Peng Zhang, SUNY Stony Brook, USA

Publicity Chairs

Vincent Xiaochuan Yu, University of New Orleans, USA

Jihe Wang, Northwest Polytechic University, China

Keke Gai, Beijing Institute of Technology, China

Md Liakat Ali, Rider University, USA

Local Chairs

Gang Zeng, Nagoya University, Japan

Web Chair

Luna Li, Adelphi University, USA

Minzhou Pan, Virginia Tech, USA

Financial Chair

Hui Zhao, Henan University, China

Steering Committee

Meikang Qiu (Chair), Dakota State University, USA

Sun-Yuan Kung, Princeton University, USA

Ruqian Lu, Chinese Academy of Sciences | CAS·Academy of Mathematics and Systems Science, China

Barbara Carminati, University of Insubria, Italy

Technical Program Committee

Angus Macaulay,The University of Melbourne, Australia

Raul Monroy,Tecnológico de Monterrey, Mexico

Suman Kumar,Troy University, USA

Zhihan Lu,Carnegie Mellon University, USA

Mohsen Amini Salehi,University of Louisiana, USA

Jiahai Yang,Tsinghua University, China

Fuji Ren,Tokushima University, Japan

Long Fei,Google Inc. USA

Jukka Riekki,University of Oulu, Finland

Xin Fang,Qualcomm,USA

Paolo Trunfio,University of Calabria, Italy

Zhong Ming,Shenzhen University, China

Yu Liu,Clarkson University, USA

Shui Yu Shui,University of Technology Sydney, Australia

Wei Zhang,SUSTech, China

Shadi Ibrahim,Inria, French

Gang Zeng,Nagoya University, Japan

Xiaofu He,Columbia University Irving Medical Center, USA

Javier Lopez,University of Malaga, Spain

Katie Cover,Portland State University, USA

Bo Luo,University of Kansas, USA

Timothy Vidas,Carnegie Mellon University, USA

Naifeng Jing,Shanghai Jiao Tong University, China

Xiaolu Zhang,University of New Haven, USA

Feng Lin,Zhejiang University, China

Ke Zeng,University of Science and Technology of China, China

George Grispos,University of Nebraska Omaha, USA

Huijun Wu,Arizona State University,USA

Zhiyuan Tan,Edinburgh Napier University, USA

Matthew Warren,Deakin University, Australia

Chungsik Song, San Jose State University, USA

Mohan Muppidi, UTSA, USA

Hao Chen, Shanghai Tech University, China

Xiaofu He, Columbia University Medical Center, USA

Zonghua Gu, Umea Univeristy, Sweden

Yong Zhang, The University of Hong Kong, China

Yu Hua, Huazhong University of Science Technology, China

Ruisheng Shi, Beijing University of Posts and Telecommunications, China

Jiaqi Zhu, Chinese Academy of Sciences, China

Jian Zhang, Institute of Software, Chinese Academy of Sciences, China

Zhiyuan Tan, Edinburgh Napier University, Scotland

Naifeng Jing, Shanghai Jiao Tong University, China

Aniello Castiglione, University of Salerno, Italy

Kan Zhang, Tsinghua University, China

Sang-Yoon Chang, Advanced Digital Science Center, Singapore

Jin Cheol Kim, KEPCO KDN, Korea

Wenbo Zhu, Google Inc. USA

William Glisson, University of South Alabama, USA

Paul Rad, Rackspace, USA

Yaru Fu, Singapore University of Technology and Design, Singapore

Hao Hu, Nanjing University, China

Haibo Zhang, University of Otago, New Zealand

Chao-Tung Yang, Tunghai University

Ruan He, Tencent Cloud, China

Petr Matousek, Brno University of Technology, Czechia

Zongming Fei, University of Kentucky, USA

Bo Luo, The University of Kansas, USA

William de Souza, University of London, United Kingdom

Malik Awan, Cardiff University, United Kingdom

Katie Cover, The Pennsylvania State University, USA

Long Fei, Google Inc. USA

征稿信息

重要日期

2024-02-01

初稿截稿日期

The 10th IEEE International Conference on High Performance and Smart Computing (IEEE HPSC 2024) is a research event cooperated with a number of conferences, such as IEEE BigDataSecurity 2024 and IEEE IDS 2024. This conference provides engineers and scientists in computing domain with an academic forum in which the new research achievements, ideas, and results are shared. The state-of-the-art smart computing applications and experiences in cloud computing and smart computing will be represented in this academic event. IEEE HPSC 2024 is the next edition of a series of successful academic events, including HPSC 2015 (New York, USA), HPSC 2016 (New York, USA), HPSC 2017 (Beijing, China), HPSC 2018 (Omaha, USA), HPSC 2019 (Washington DC, USA), HPSC 2020 (Baltimore, USA), HPSC 2021 (New York, USA), HPSC 2022 (Jinan, China) and HPSC 2023 (New York, USA).

Topics of particular interest include, but are not limited to: