EPEPS is the premier international conference on advanced and emerging issues in the electrical modeling, analysis, and design of electronic interconnections, packages, and systems. Over four days, the conference will feature the latest advancements in modeling, design, and measurement techniques for:
of systems for high-speed electronics, RF and wireless communication, and quantum computing.
We look forward to seeing you in Toronto!
We welcome new and unpublished contributions on:
10月06日
2024
10月09日
2024
初稿截稿日期
注册截止日期
2016年10月23日 美国 San Diego,USA
2016 IEEE 25th Conference on Electrical Performance of Electronic Packaging and Systems2013年10月27日 美国
2013 IEEE第22届电子封装系统的电气性能会议
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