活动简介

6th IEEE International Conference on Knowledge Innovation and Invention 2023 (IEEE ICKII 2023) will be held in Sapporo ,Hokkaido ,Japan on August 11-13, 2023, and it will provide a unified communication platform for researchers in the topics of information technology, innovation design, communication science & engineering, industrial design, creative design, applied mathematics, computer science, electrical & electronic engineering, mechanical & automation engineering, green technology & architecture engineering, material science and other related fields. Professional practice in the information, innovation, communication, and engineering fields are welcome to participate in IEEE ICKII 2023. This conference enables interdisciplinary collaboration of science and engineering technologists in the academic and industrial fields, as well as networking internationally. During the conference, there will be substantial time for presentation and discussion. Attendants will find various activities useful in bringing together a diverse group of engineers and technologists across the disciplines for the generation of new ideas, collaboration potential and business opportunities.

The conference proceedings will be submitted to the IEEE Xplore® digital library if the papers fit the scopes of IEEE (IEEE fields). Papers of other fields will be sent to Scopus for reviewed and indexed. To maintain a high quality of conference proceedings, the English of full papers should be good enough. We will request authors to send the full papers for English editing if the papers do not pass the review process by the Program Committees.

 

Excellent papers selected from IEEE ICKII 2023 will be recommended to be published on suitable 12 different SSCI, SCI and Scopus journals after an additional review process and need extra publication charge.

征稿信息

重要日期

2023-06-15
摘要截稿日期
2023-06-22
摘要录用日期
2023-07-20
终稿截稿日期

The conference proceedings will be submitted to the IEEE Xplore® digital library if the papers fit the scopes of IEEE (IEEE fields). Papers of other fields will be sent to Scopus for reviewed and indexed. To maintain a high quality of conference proceedings, the English of full papers should be good enough. We will request authors to send the full papers for English editing if the papers do not pass the review process by the Program Committees.

征稿范围

A. Material Science & Engineering
B. Communication Science & Engineering
C. Computer Science & Information Technology
D. Computational Science & Engineering
E. Electrical & Electronic Engineering
F. Mechanical & Automation Engineering
G. Green Technology & Architecture Engineering
H. Internet & IOT technology
I. Applied Mathematics
J. Innovation Design & Creative Design
K. Industrial Design &Design Theory
L. Cultural & Creative Research

M. Others  

作者指南

The official language is English. Please use our online submission system http://www.ickii.org/ for submitting abstract before June 15, 2023. Prospective authors with accepted abstract are invited to submit their full paper through online submission system by July 22, 2023. Technical papers on the aspects related to (but not limited to) those in the topics of interest are invited for oral or poster presentation. Length of a full paper is limited within 6 pages, and should not be less than 3 pages. 

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重要日期
  • 会议日期

    08月11日

    2023

    08月13日

    2023

  • 06月15日 2023

    摘要截稿日期

  • 06月22日 2023

    摘要录用通知日期

  • 07月20日 2023

    终稿截稿日期

  • 08月13日 2023

    注册截止日期

主办单位
IEEE Tainan Section Sensors Council
International Institute of Knowledge Innovation and Invention
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