AboutComponents, Circuits, Devices and Systems; Engineered Materials, Dielectrics and Plasmas; Engineering Profession; Fields, Waves and Electromagnetics; Photonics and Electrooptics
Keywords:Microelectronics,electronic packaging,3d-integration Packaging Technologies,Chip scale packaging,Interconnect Reliability,interconnects,3d Integration,
Scope:The conference brings together both academics as well as industry leaders to discuss and debate the state-of-the-art and future trends in microelectronics components, packaging, integration and manufacturing technologies.
Sponsor Type:1; 9