AboutBioengineering; Components, Circuits, Devices and Systems; Engineered Materials, Dielectrics and Plasmas; Photonics and Electrooptics; Power, Energy and Industry Applications
Keywords:Electronics Packaging,Integrated Photonics,Advanced Packaging,Power Electronics,Bioelectronics,Automotive Electronics,
Scope:This symposium pictures the future state of the electronics packaging which impacts the infrastructures of datacenter, network and edge equipment. The symposium also tries to predict where the packaging technology is heading. The symposium will emphasize the following main topics: Photonics, Advanced Packaging, Power Electronics, Automotive, Bioelectronics, and Healthcare to discuss about the technologies on Electronics Packaging especially in terms of the evolution of chiplet technology.
Sponsor Type:1