活动简介
AboutAerospace; Bioengineering; Communication, Networking and Broadcast Technologies; Components, Circuits, Devices and Systems; Computing and Processing; Power, Energy and Industry Applications; Robotics and Control Systems
Keywords:AI test and Test for AI,Analog and Mixed-Signal Test,RF and High-Speed IO Test,Fault Modeling and Simulation,ATPG,Design for Testability,Built-In Self-Test,Test Compression,Memory Test, Diagnosis, and Repair,Fault Diagnosis and Failure Analysis ,Yield Analysis and Learning,Safety and Test for Automotive ICs,Test for Internet of Things,MEMS Test,SiP, Chiplet, 2.5D and 3D IC Test,Fault Tolerance,Power-Reliability and Testing for Quantum Computing,Reli
Scope:The electric testing of semiconductor integrated circuits, devices, boards, and computer systems, covering design verification, test, fault diagnosis, and so on. failure analysis, yield improvement, etc.
Sponsor Type:1; 9; 9
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