活动简介
Invitation:
It is our great pleasure to invite you to the 18th International Conference on Electrorheological Fluids and Magnetorheological Suspensions (ERMR2023) in Chongqing, China from 9 June (Friday) to 12 June (Monday) 2023.
The ERMR2023 covers science and technologies relevant to electro-responsive (ER) and magneto-responsive (MR) materials. Its overall scope spans basic science and materials to engineering applications. The technical presentations of the conference will be organized into a single oral session and a poster session where all attendees can exchange ideas in a relaxed atmosphere. Researchers, practitioners and students are welcome to present and discuss their latest research and innovations.
Authors who present papers at the ERMR2023 conference are encouraged to submit journal quality papers to special issues to be organized in either Journal of Intelligent Material Systems and Structures or Smart Materials and Structures. Such submissions will be considered following the usual review procedures of each journal to ensure that papers meet scope and quality requirements for the journals.
January 2023
Miao Yu, Chongqing University
Chairman of ERMR2023
组委会
Hosts of ERMR2023
➢ Chongqing University of China
➢ University of Science and Technology of China
ERMR2023 Organizing Committee:
➢ Chairman of Organizing Committee
Prof. Miao Yu (Chongqing University, China)
➢ Co－Chairman of Organizing Committee
Prof. Xinglong Gong (University of Science and Technology of China, China)
➢ International OrganizingCommittee
Dr. Daniel Barber, Lord Corporation, USA
Dr. Holger Boese, Fraunhofer Institute, Germany
Prof. Antonio Jose Faria Bombard, Federal University of Itajubá, Brazil
Prof. Georges Bossis, University of Nice, FranceProf. Andrejs Cebers, Institute of Physics, Latvia
Prof. Hyoung Jin Choi, Inha University, Korea
Prof. Seung-Bok Choi, Inha University, Korea
Prof. Juan de Vicente, University of Granada, Spain
Prof. Xinglong Gong, University of Science and Technology of China, China
Prof. Fernando Gonzalez-Caballero, University of Granada, Spain
Prof. Faramarz Gordaninejad, University of Nevada, Reno, USA
Prof. Daniel J. Klingenberg, University of Wisconsin, Madison, USA
Prof. William Kordonski, QED Technologies Inc., USA
Prof. Evguenia Korobko, A. V. Lykov Heat and Mass Transfer Institute, Belarus
Prof. Weihua Li, University of Wollongong, Australia
Prof. Kunquan Lu, Chinese Academy of Science, China
Prof. James E. Martin, Sandia National Laboratory, USA
Prof. Masami Nakano, Tohoku University, Japan
Prof. Stefan Odenbach, Technische Universitat, Dresden, Germany
Prof. Ping Sheng, Hong Kong University of Science and Technology, China
Prof. Rongjia Tao, Temple University, USA
Prof. Halil Ibrahim Unal, Gazi University, Turkey
Dr. Xiaojie Wang, Chinese Academy of Science, China
Prof. Weijia Wen, Hong Kong University of Science and Technology, China
Prof. Norman M. Wereley, University of Maryland, USA
Prof. Miao Yu, Chongqing University, China
Prof. Xiaopeng Zhao, Northwestern Polytechnical University
Prof. Andrey Zubarev, Ural Federal University, Russia
➢ Local Organizing Committee
Prof. Jie Fu (Chongqing University, China)
Assoc. Prof. Song Qi (Chongqing University, China)
Prof. Xiaomin Dong (Chongqing University, China)
Prof. Huaxia Deng (University of Science and Technology of China, China)
Prof. Shuaishuai Sun (University of Science and Technology of China, China)
Assoc. Prof. Sheng Wang (University of Science and Technology of China, China)
Dr. Lei Luo (Chongqing University, China)
Dr. Mi Zhu (Chongqing University of Technology, China)
Assoc. Pro. Hao Zhang (Chongqing University of Science and Technology, China)
Assoc. Pro. Pingan Yang (Chongqing University of Posts and Telecommunications, China)
Dr. Lirui Wang (Chongqing University of Science and Technology, China)
征稿信息
重要日期
2023-03-31
摘要截稿日期
2023-03-15
摘要录用日期
2023-09-20
初稿截稿日期
Call for Papers:
- Abstract Submission (Essential for all presenters)
- Contributions are solicited of original unpublished works related to the main topics in a symposium of this conference. Abstracts should be submitted to www.ermr2023.com not later than by 28 February 2023. (Submission system will go live by 31 January 2023).
- Please include title, authors with email addresses for each author, and a 200-500 word abstract in a Word document.
- Registration/Event Questions: Please contact the conference mailbox at ermr2023@cqu.edu.cn.
- Manuscript Submission (Optional)
- Papers presented at the conference are encouraged to be submitted in the special issues of either Smart Materials and Structures or Journal of Intelligent Material Systems and Structures, with their full consideration of a scope and quality for publication. The period of submission is from 1 August 2023 to 31 October 2023.
- For more information
- Please visit www.ermr2023.com . Website will go live by mid-January.
Important Dates:
- Abstract Submission Open: 31 January 2023
- Abstract Submission SOFT Deadline: 28 February 2023
- Acceptance Notification: 15 March 2023
- Early Registration Due: 1 April 2023
- Manuscript Submission Open: 1 August 2023
- Manuscript Submission Deadline: 31 October 2023
征稿范围
Topics:
➢ Electrorheological (ER) fluids: materials and physical properties
➢ Electrorheological gels and elastomers
➢ Ferrofluids: materials and applications
➢ Magnetorheological (MR) suspensions: materials and characteristics
➢ MR elastomers and gels: materials and physical properties
➢ Stimuli-responsive bio-materials and colloids
➢ Emerging stimuli-responsive materials including graphene, graphene oxide, LC, Pickering, new type of magnetic particles, and etc.
➢ Smart fluid based energy saving and harvest
➢ ER and MR polishing
➢ Engineering applications of ER and MR materials
➢ Medical and pharmaceutical applications of ER and MR materials
➢ Other related field-responsive systems
全部留言
重要日期
-
会议日期
06月09日
2023
至06月12日
2023
-
03月15日 2023
摘要录用通知日期
-
03月31日 2023
摘要截稿日期
-
06月12日 2023
注册截止日期
-
09月20日 2023
初稿截稿日期
主办单位
Chongqing University
University of Science and Technology of China
University of Science and Technology of China
联系方式
- Registration/Event Questions
- er******@cqu.edu.cn
留言