活动简介
IEEE FLEPS 2023 is intended to provide a forum for research scientists, engineers, and practitioners throughout the world to present their latest research findings, ideas, and applications in the area of Flexible and Printable Sensors and Systems.
征稿信息
重要日期
2023-03-05
初稿截稿日期
2023-04-21
初稿录用日期
2023-05-05
终稿截稿日期
IEEE FLEPS 2023 is intended to provide a forum for research scientists, engineers, and practitioners throughout the world to present their latest research findings, ideas, and applications in the area of Flexible and Printable Sensors and Systems.
征稿范围
- Organic/Inorganic Electronics and Sensors
- Advanced Manufacturing Techniques
- Hybrid Flexible Sensors and Electronics
- Soft/Smart Wearable and Implantable Sensing Systems
- Printed Large-Area Sensors and Systems
- Emerging applications of Flexible Electronics inc. IoT, smart cities etc.
- Flexible/Printable Electronics in context with Circular and Green Electronics
- Emerging Materials for Flexible and Printable Systems
- High-throughput Printable Electronics
- Stretchable/Shrinkable Sensors and Electronics
- Disposable/Reusable Sensors and Electronics
- Active and Passive Components (e.g. actuators, printed energy devices, smart labels, RFID etc.)
- Reliability, Simulation and Modelling
全部留言
重要日期
-
会议日期
07月09日
2023
至07月12日
2023
-
03月05日 2023
初稿截稿日期
-
04月21日 2023
初稿录用通知日期
-
05月05日 2023
终稿截稿日期
主办单位
IEEE Sensors Council
联系方式
- Miss Claire Folkerts
- cf******@conferencecatalysts.com
留言