活动简介

Circuits and systems for AI Deep learning/machine learning/AI algorithms Tools/platforms for AI Architecture for AI computing Hardware/software co-design and design automation for AI systems Advanced neural network design Neuromorphic circuits, processors, and systems and their applications Emerging applications: Internet-of-things, healthcare, smart factories, environment Emerging devices and materials for AI Computer vision algorithms and architectures Recommendation system, language/text processing Autonomous/unmanned vehicles and drone Robotics and automation Metaverse and AR/VR Deep learning/machine learning for Future Wireless Communications.

Sponsor Type:1

组委会

Honorary Co-Chairs

·Qionghai Dai,Tsinghua University,China

General Co-Chairs

·Mohamad Sawan,Westlake University,China

·Shao-Jun Wei,Tsinghua University,China

Technical Program Co-Chairs

.Yong Lian,York UniversityCanada

.Yen-Kuang Chen,Princeton Al GroupUSA

·Abe Elfadel, Khalifa University,UAE
 

征稿信息

重要日期

2023-02-03
初稿截稿日期
2023-03-24
初稿录用日期

征稿范围

Topics of Interest Include but not Limited to: 

■ Circuits and systems for AI
■ Deep learning/machine learning/AI algorithms
■ Tools/platforms for AI
■ Architecture for AI computing
■ Hardware/software co-design and design automation for AI systems
■ Advanced neural network design
■ Neuromorphic circuits, processors, and systems and their applications
■ Emerging applications: Internet-of-things, healthcare, smart factories, environment 
■ Emerging devices and materials for AI
■ Computer vision algorithms and architectures
■ Recommendation system, language/text processing
■ Autonomous/unmanned vehicles and drone
■ Robotics and automation
■ Metaverse and AR/VR
■ Deep learning/machine learning for Future Wireless Communications

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重要日期
  • 会议日期

    06月11日

    2023

    06月13日

    2023

  • 02月03日 2023

    初稿截稿日期

  • 03月24日 2023

    初稿录用通知日期

  • 06月13日 2023

    注册截止日期

主办单位
IEEE Circuits and Systems Society
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