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In this digital electronics, electronic materials are occupying an integral part on all electronic and electro-mechanical devices. Since, the performance any electronic applications are directly dependent on the materials used, the invention of advanced materials are becoming as the backbone of any electronic applications in order to upgrade its functionality as well as the capacity. The research and development on material science will remain as the starting point for future advances in electronics. Henceforth, this 4th International Conference on Inventive Research in Material Science and Technology [ICIRMST 2023] aims to report the science and technology of electronic materials. Also, ICIRMST 2023 intends to examine and showcase the new applications of semiconductors, optical and display materials, metallic and magnetic alloys and so on. Also, we welcome the research articles that report state-of-the-art methods for fabricating advanced materials and evaluate the physical, chemical, optical, and electronic properties.

组委会

General Chair

Dr. S. Vijayan,
Principal,
RVS Technical Campus,
Coimbatore, India.

Program Chair

Dr. S D Prabu Ragavendiran,
Head of the Department,
Department of Computer Science Engineering

Program Vice Chair

Dr. S Narayanamoorthy,
Head of the Department,
Department of Mechatronics Engineering

Tutorial and Workshop Chairs

Dr. S Sridhar,
Head of the Department,
Department of Automobile Engineering

Dr. D Rajkumar,
Head of the Department,
Department of Agriculture Engineering

Local Arrangement Chair

Dr. A G Mohandas Gandhi,
Head of the Department,
Department of Civil Engineering

Conference Chair

Dr. S. Smys,
Professor, Department of CSE,
RVS Technical Campus,
Coimbatore, India.

Technical Program Chairs

Dr. S. Smys, Professor, RVS Technical Campus, Coimbatore, India.
Dr. Hui-Ming Wee, Distinguished Professor, Department of Industrial and Systems Engineering, Chaplain, Chung Yuan Christian University (CYCU), Taiwan.
Dr. Joy Iong-Zong Chen, Professor, Electrical Engineering, Dayeh University, Taiwan.
Dr. Abbas Khosravi, Institute for Intelligent Systems Research and Innovation, Deakin University, Australia.
Dr. Jadwiga Fangrat, Professor, Instytut Techniki Budowlanej, Poland.
Dr. Subarna Shakya, Department of Electronics and Computer engineering, Pulchowk Campus, Institute of Engineering, Tribhuvan University, Nepal.
Dr. M V Reddy, Noveau Monde Graphite (new Graphite world), Quebec , Canada.

Technical Program Committee

Dr. Wenbin Zhou, Mechanics of Materials Division, Department of Mechanical Engineering, Imperial College, London.
Dr. Manisha Malviya, Professor, Department of Chemistry, Indian Institute of Technology (BHU), Varanasi.
Dr. Ekta Goel, Professor, ECE Department, NIT Warangal.
Dr Deepak Kumar Jarwal, Professor, PDPU, Gandhinagar.
Dr. B. Ramesh, Professor, Institute of Mechanical Engineering, Saveetha School of Engineering, Chennai.
Dr.S.Venkatramana Reddy, Associate Professor, Department of Physics, S.V.U.College of Sciences, S.V.University, India.
Dr. Ajay Kumar, Professor, Civil Engineering Department, National Institute of Technology, Patna.
Prof B. Deva Prasad Raju, Department of Physics, Sri Venkateswara University, Tirupati.
Dr. Ateeque Malani, Professor, Chemical Engineering, Indian Institute of Technology, Bombay.
Dr. Gopal Rawat, Dept of ECE, Indian Institute of Technology (BHU), Varanasi.
Dr. Ranjana Jha, Professor& Head, Research Lab for Energy Systems, Department of Physics, Netaji Subhas Universityof Technology, New Delhi, India.
Dr. Karuna Kumari, Professor, Department of Engineering Physics, HKBK College of Engineering, Bengaluru.
Dr. Căprărescu Simona, University POLITEHNICA of Bucharest, Faculty of Chemical Engineering and Biotechnologies, Department of Inorganic Chemistry, Romania.
Dr. Jihad M. Hadi , Department of Medical Laboratory of Science, College of Health Sciences, Iraq.
Dr. K. Debnath, Professor, Department of Mechanical Engineering, National Institute of Technology, Meghalaya.
Prof. Pavlo Maruschak, Ternopil Ivan Puluj National Technical University, Ukraine.
Dr. Karuna Kumari, Assistant Professor, Department of Engineering Physics, HKBK College of Engineering, Bengaluru, India.
Dr. Henryk Kania, Silesian University of Technology in Gliwice, Department of Mtalurgy and Recycling, Katowice, Poland.
Dr. Swasti Bhatia, IMEC, Leuven, Belgium.
Dr. Armin Yousefi, Professor, Nottingham Trent University, Iraq.
Dr. Mohammad Firdaus Abu Hashim, Faculty of Mechanical Engineering Technology, Center of Excellence Geopolymer & Green Technology (CEGeoGTech), Universiti Malaysia Perlis, Perlis, Malaysia.
Dr. Abu Zaharin Ahmad, Associate Professor, Faculty of Electrical & Electronics Engineering, Universiti Malaysia Pahang, Pahang, Malaysia.
Dr. Pavel Kejzlar, Technical University of Liberec, Liberec, Czech Republic.
Dr. Amlana Panda, School of Mechanical Engineering, KIIT Deemed to be University, Bhubaneswar, Odisha, India.
Dr. Liliana Dobrzańska, Uniwersytet Mikołaja Kopernika, Toruń, Poland.
Prof. Ir. Dr. Badrul Hisham Ahmad, Faculty of Electronics and Computer Engineering, Universiti Teknikal Malaysia Melaka, Hang Tuah Jaya, Melaka, Malaysia.
Dr. Bilal SAOUD, University of Bouira, Algeria.
Dr. P. A. Alvi, Banasthali Vidyapith, Banasthali, Rajasthan, India.
Dr. Patrick Fiati, Cape Coast Technical University, Ghana.
Dr. Hedayat Omidvar, Head of Project Planning and Control, Research & Technology Department, National Iranian Gas Company (NIGC), Iran.
Dr. Vinod Singh Yadav, Department of Mechanical Engineering, National Institute of Technology, Uttarakhand, India.
Dr. Violeta Purcar, National Institute for Research and Development in Chemistry and Petrochemistry, Romania.

征稿信息

重要日期

2023-01-15
初稿截稿日期

The primary objective of ICIRMST is to foster a focused attention on the latest research progress in inventive electronic material and material processing technologies. This conference aims to solicit novel research contributions that address the challenges of advanced electronic materials and technologies. ICIRMST invites researchers and practitioners from both industry and academia to submit their contributions on the below mentioned topics.

征稿范围

Advanced Electronic Materials

Functional and Multifunctional Materials
Bio Inspired Lightweight Electronic Materials
Flexible/Stretchable Electronics
Micro/Nano Electronic Materials
Electromagnetic shielding materials
Dielectric & Magnetic materials
Piezoelectric and ferroelectric materials
Optoelectronic materials
Metamaterial-based devices
Wearable electronic materials
Nanosensors and Nanodevices
Sustainable and Advanced Semiconductor Materials

Inventive Material Technologies

Micro/Nano Fabrication Technologies
Processing and Characterization of Smart Materials
Sustainable Materials and Thin-Film Technology
Advanced Material Characterization and Testing Models
Advanced Mechanisms of Superconductivity
Interface Engineering
Nanophosphors and Radiation Effects Measurement
Smart Materials Processing to Transform Material Properties
Electronic Packaging and Distributed Analysis
Process Modeling and Simulation
Machine Learning for Electronic and Metamaterial Design
Electronic Materials for Computer & Communication

作者指南

Submission Mode:

  • Author[s] must forward their full-paper [12-15 pages] to the conference email ( icirmst.confdesk@gmail.com ). Earlier paper submission is encouraged as it helps us to manage the review process in a timely manner.
  • Manuscript Preparation Guidelines & Submission Template:
  • Papers must not exceed 5000 words in length, including abstract, figures, references and appendices.
  • Before submitting your paper, please ensure that it has been carefully read for typographical and grammatical errors. Avoid using both British and American English in a paper. Papers will be returned if the standard of English is not considered to be good enough for publication.
  • Figures should be designed with clear, large type and visible graphics. Each figure or table should have a heading of one or two lines.
  • Papers should be submitted as a .doc or .pdf attachment by email to the conference chair.
  • All papers received by the due date will be sent for peer review process.

The following downloads will help you to prepare your paper for submission. Also note that the Sample Paper Template is a blank Word file with pre-prepared styles for headings etc. 

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重要日期
  • 会议日期

    01月20日

    2023

    01月21日

    2023

  • 01月15日 2023

    初稿截稿日期

主办单位
RVS Technical Campus, Coimbatore
承办单位
RVS Technical Campus, Coimbatore
协办单位
Springer
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