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活动简介

The E Conferences is a federated organization dedicated to bringing together a significant number of diverse scholarly events for presentation within the conference program. Events will run over a span of time during the conference depending on the number and length of the presentations.

ICSMT 2023: International Conference Smart Materials Technologies 2023 aims to bring together leading academic scientists, researchers and research scholars to exchange and share their experiences and research results on all aspects of Smart Materials Technologies. It also provides a premier interdisciplinary platform for researchers, practitioners and educators to present and discuss the most recent innovations, trends, and concerns as well as practical challenges encountered and solutions adopted in the fields of Smart Materials Technologies.

征稿信息

International Conference on Smart Materials Technologies 2023 provides a leading forum for the presentation of new advances and research results in the fields of Smart Materials Technologies. The conference will bring together leading researchers, businessman and scientists in the domain of interest from around the world.

征稿范围

Metallic Alloys
Tool Materials
Superplastic Materials
Ceramics and Glasses
Composites
Amorphous Materials
Nuclear fuel materials
Biomaterials
Magnetic Materials
Multi Functional Magnetic Materials
Nuclear Materials IV
Superconducting Materials
Spintronics Materials and Devices
Structured Materials
Hard/Soft Magnetic Materials
Crosscutting materials
Casting
Welding
Sintering
Powder Metallurgy
Thermo-Chemical Treatment
Thin & Thick Coatings
Surface Treatment
Plastic Forming
Quality Assessment
Mechatronics
Automation Engineering Processes
Robotics
Technological Devices and Equipment
Industrial Application of Cleaner Production Methods
Theoretical Fundamentals of Cleaner Production
Production and Operations Management
Production Planning and Control
Manufacturing Technology Management
Electron Microscopy
Quality Management
X-ray Phase Analysis
Metallographic
Quantitative Metallographic
Computer Assistance in the Engineering Tasks and Scientific Research
Image Analysis
Numerical Techniques
Statistic Methods
Residual Life Analysis
Process Systems Design
Mould Flow Analysis
Rapid Prototyping
CAM, CAMS & CAQ
Civil Rights
Engineering Design
Materials Design
Ductility
Crack Resistance
Fatigue
Creep-resistance
Fracture Mechanics
Mechanical Properties
Electrical Properties
Magnetic Properties
Corrosion, Erosion
Wear Resistance
Non-Destructive Testing
Reliability Assessment
Working Properties of Materials and Products
Toxicity
Large Scale Applications
Electronics Applications

作者指南

Authors should submit a paper in English, carefully checked for correct grammar and spelling, addressing one or several of the conference areas or topics. Each paper should clearly indicate the nature of its technical/scientific contribution and the problems, domains or environments to which it is applicable. Only original papers should be submitted. Authors are advised to follow ethical norms regarding plagiarism and self-plagiarism thoroughly before submitting and must make sure that their submissions do not substantially overlap work which has been published elsewhere or simultaneously submitted to a journal or another conference with proceedings. Papers that contain any form of plagiarism will be rejected without reviews.

Authors can submit their work in the form of a Regular Paper, representing completed and validated research, or as a Position Paper, portraying a short report of work in progress or an arguable opinion about an issue discussing ideas, facts, situations, methods, procedures or results of scientific research focused on one of the conference topic areas. All papers must be submitted through the online submission platform. After the paper submission has been successfully completed, authors will receive an automatic confirmation e-mail.

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重要日期
  • 会议日期

    05月13日

    2023

    05月14日

    2023

主办单位
E Conferences
承办单位
Association of Scientists, Developers and Faculties [ASDF]
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