活动简介

The IEEE/ACM International Symposium on Microarchitecture® is the premier forum for presenting, discussing, and debating innovative microarchitecture ideas and techniques for advanced computing and communication systems. This symposium brings together researchers in fields related to microarchitecture, compilers, chips, and systems for technical exchange on traditional microarchitecture topics and emerging research areas. The MICRO community has enjoyed a close interaction between academic researchers and industrial designers, and we aim to continue this tradition at MICRO-55. In 2022, MICRO goes to Chicago, Illinois.

组委会
General Co-Chairs Nikos Hardavellas
Northwestern University
Simone Campanoni
Northwestern University
Program Co-Chairs Boris Grot
University of Edinburgh
Ulya Karpuzcu
University of Minnesota, Twin Cities
Tutorials & Workshops Co-Chairs Antonia Zhai
University of Minnesota, Twin Cities
Yuhao Zhu
University of Rochester
Web Co-Chairs Saugata Ghose
University of Illinois Urbana-Champaign
Dimitrios Skarlatos
Carnegie Mellon University
Submission Co-Chairs Hüsrev Cılasun
University of Minnesota, Twin Cities
M.R. Siavash Katebzadeh
University of Edinburgh
Publicity & Social Media Chair Georgios Tziantzioulis
Princeton University
Finance Chair Svilen Kanev
Google
Travel Awards Chair Ashish Venkat
University of Virginia
Registration Chair Timothy Rogers
Purdue University
Publications Chair Divya Mahajan
Microsoft Research
Artifact Evaluation Co-Chairs Alexandros Daglis
Georgia Institute of Technology
Jason Lowe-Power
University of California, Davis
Local Arrangements Co-Chairs Inna Partin-Vaisband
University of Illinois Chicago
Rujia Wang
Illinois Institute of Technology
Student Research Competition Co-Chairs Russ Joseph
Northwestern University
Nayana Nagendra
Arm Ltd.
征稿信息

重要日期

2022-04-14
摘要截稿日期
2022-04-21
初稿截稿日期
2022-07-18
初稿录用日期

MICRO 2022 program co-chairs Ulya Karpuzcu (University of Minnesota, Twin Cities) and Boris Grot (University of Edinburgh) have released this year's call for papers. Paper abstracts must be uploaded on HotCRP no later than April 14, 2022 at 11:59 PM PDT, and full papers are due on April 21, 2022 at 11:59 PM PDT. Good luck with your submissions!

征稿范围

We invite original paper submissions related to (but not limited to) the following topics:

  • Processor, memory, and storage architectures
  • Multicore and multiprocessor systems
  • Instruction-, thread-, and data-level parallelism
  • Cloud and datacenter-scale computing
  • IoT, mobile, and embedded architecture
  • Interconnection network, router, and network interface architecture
  • Accelerator-based, application-specific, and reconfigurable architectures
  • Architectural support for programming languages or software development
  • Architectural support for security and privacy
  • Architectural support for virtualization
  • Architectures for emerging technologies and applications
  • Architectural support for non-volatile/persistent memory
  • Quantum computing
  • In-/near-memory or in-/near-storage processing
  • Approximate computing and architectural support for approximation
  • Dependable processor and system architecture
  • Effects of circuits and technology on architecture
  • Architecture modeling and simulation methodologies
  • Evaluation and measurement of real computing systems
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重要日期
  • 会议日期

    10月01日

    2022

    10月05日

    2022

  • 04月14日 2022

    摘要截稿日期

  • 04月21日 2022

    初稿截稿日期

  • 07月18日 2022

    初稿录用通知日期

  • 10月05日 2022

    注册截止日期

主办单位
IEEE Computer Society
Association for Computing Machinery Special Interest Group on Microarchitectural Research & Processing - ACM SIGMICRO
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