The IEEE/ACM International Symposium on Microarchitecture® is the premier forum for presenting, discussing, and debating innovative microarchitecture ideas and techniques for advanced computing and communication systems. This symposium brings together researchers in fields related to microarchitecture, compilers, chips, and systems for technical exchange on traditional microarchitecture topics and emerging research areas. The MICRO community has enjoyed a close interaction between academic researchers and industrial designers, and we aim to continue this tradition at MICRO-55. In 2022, MICRO goes to Chicago, Illinois.
General Co-Chairs | Nikos Hardavellas Northwestern University |
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Simone Campanoni Northwestern University |
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Program Co-Chairs | Boris Grot University of Edinburgh |
Ulya Karpuzcu University of Minnesota, Twin Cities |
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Tutorials & Workshops Co-Chairs | Antonia Zhai University of Minnesota, Twin Cities |
Yuhao Zhu University of Rochester |
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Web Co-Chairs | Saugata Ghose University of Illinois Urbana-Champaign |
Dimitrios Skarlatos Carnegie Mellon University |
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Submission Co-Chairs | Hüsrev Cılasun University of Minnesota, Twin Cities |
M.R. Siavash Katebzadeh University of Edinburgh |
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Publicity & Social Media Chair | Georgios Tziantzioulis Princeton University |
Finance Chair | Svilen Kanev |
Travel Awards Chair | Ashish Venkat University of Virginia |
Registration Chair | Timothy Rogers Purdue University |
Publications Chair | Divya Mahajan Microsoft Research |
Artifact Evaluation Co-Chairs | Alexandros Daglis Georgia Institute of Technology |
Jason Lowe-Power University of California, Davis |
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Local Arrangements Co-Chairs | Inna Partin-Vaisband University of Illinois Chicago |
Rujia Wang Illinois Institute of Technology |
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Student Research Competition Co-Chairs | Russ Joseph Northwestern University |
Nayana Nagendra Arm Ltd. |
MICRO 2022 program co-chairs Ulya Karpuzcu (University of Minnesota, Twin Cities) and Boris Grot (University of Edinburgh) have released this year's call for papers. Paper abstracts must be uploaded on HotCRP no later than April 14, 2022 at 11:59 PM PDT, and full papers are due on April 21, 2022 at 11:59 PM PDT. Good luck with your submissions!
We invite original paper submissions related to (but not limited to) the following topics:
10月01日
2022
10月05日
2022
摘要截稿日期
初稿截稿日期
初稿录用通知日期
注册截止日期
2018年10月20日 日本
2018 51st Annual IEEE/ACM International Symposium on Microarchitecture2017年10月14日 美国
2017年第50届IEEE / ACM国际微架构研讨会2016年10月15日 台湾-中国 Taipei,China
2016 49th Annual IEEE/ACM International Symposium on Microarchitecture2014年12月13日 英国
2014年第47届IEEE/ ACM国际微架构研讨会
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