活动简介

The 2022 IEEE Electron Device Kolkata Conference (2022 IEEE EDKCON) will be held in The Science City, Kolkata, India during November 26-27, 2022. Organized by IEEE EDS Kolkata Chapter, EDKCON 2022 is expected to bring together researchers, educators, students from across academia, government, industry, and non-governmental organizations to discuss, share and promote current works and recent accomplishments across all aspects of Electron Devices and circuits. Original unpublished papers are solicited.

Accepted and presented papers will be submitted for inclusion into IEEE Xplore subject to meeting IEEE Xplore’s scope and quality requirements

组委会

Executive Committee

Chief Patron:

Ravi M. Todi, EDS President

General Chair:

Prof. C K Sarkar, Prof. Samar Saha

Conference Chair:

Prof. Hafizur Rahaman, Dr. Mousiki Kar

Advisory Committee:

Prof. P. P .Chakrabarty (IITKGP), Prof. S.K.Ray (SNBNCBS), Prof. R. Rao (IITD), Prof. T. K. Bhattacharyya (IITKGP),MK Radhakrishnan (NanoRel), S. Iyer (Univ of California, LA), B. Iniguez (Univ Rovira, Virgili), N. K. Bhat (IISc)

Conveners:

Prof. D. De (MAKAUT), Prof. S. K. Sarkar (JU)

Publication Chair:

Prof. J. K. Mandal (KU)

Publicity Chair:

Prof. A. Haque (East west Univ), Prof. A. K. Panda (NIST Berhampur)

Publicity Vice-Chair:

Dr. N. M. Kumar (GITM), D. Nirmal (Karunya University)

Sponsorship Chair:

Dr. Atanu Kundu

TPC Chair:

Dr. Angsuman Sarkar, Dr. Manash Chanda, Dr. Soumya Pandit

Treasurer:

Dr. Saheli Sarkhel, Dr. Sandip Nandi

Web Master:
S Ganguly

征稿信息

重要日期

2022-06-15
初稿截稿日期
2022-10-15
初稿录用日期
2022-09-15
终稿截稿日期

征稿范围

Track 1: Emerging Devices and Technology (EDT)

Biodegradable and Flexible Electronic Devices; Electron Devices for “More than Moore”, 2D and devices on low-dimensional materials, Neuromorphic and approximate computing devices, Spintronic and magnetic devices, Steep-slope devices, Quantum computing devices, Cryogenic Devices, Topological materials and devices, and phase transitions transistors, Compound Semiconductors and High-Speed Devices, Wearable electronics. Wide bandgap and ultra-wide bandgap semiconductors, Power devices, High Performance III-V, III-Nitride and Si, SiGe devices for mm-wave to THz.Device and circuits for 5G and 6G, Power device technologies for micro and mm-wave.

Track-2: Analog/Digital/ Mixed Mode Circuits and Systems (ADM-CS)

Analog and Mixed Signal Circuits and Systems, Communications Circuits and Systems, Sensory Circuits and Systems, Nonlinear Systems and Circuit Theory, Visual Signal Processing and Communications Education in Circuits and Systems, Beyond CMOS: Nanoelectronics and Hybrid Systems Integration Digital Integrated Circuits and Systems, Power and Energy Circuits and Systems, Biomedical Circuits and Systems Neural Networks and Neuromorphic Engineering, Digital Signal Processing, Multimedia Systems and Applications, Low power circuits and system, high speed circuits and systems. Control electronics for Quantum Computing.

Track 3: Memory devices and Technology (MDT)

3D memory technologies, Conventional memories, Emerging memories for neural networks and AI/ML applications, Computing-in-memory, new memory hierarchy.

Track-4: Device Modeling and Simulations (DMS)

Multiscale simulation with hybrid techniques, TCAD and benchmarking, Atomistic simulation, Compact models for device/system technology co-optimizations, Alternative computing device modeling, modeling of emerging devices, Material and interconnect modeling, Advanced packaging and 3D integration modeling, Device modeling for photonics, sensor computing, RF device and circuits, and MEMS.

Track 5: Nano-electronic Devices and Technology (NDT)

Novel nanomaterials and devices, Nanobiotechnology, Nanomaterials for energy conversion, Green nanotechnology, Nano Mechanics, Carbon Nanotubes emitters, Biological applications of nanoparticles, Nano Fabrication and Metrology, Nano Heat Transfer and Energy Information Technology, Nano Sensors, Actuators and Systems Nanobionics, Nanofluidics and Bio Chips, Organic Electronics, nanowires and nanosheets.

Track 6: Advance Processing and characterizations

Advanced, novel process integration schemes and (applications-driven) scaling approaches, Device/System technology co-optimization, Sequential, monolithic 3D integration, heterogenous chiplets, 2.5/3D integration, Interconnects (TSV, BEOL, Frontside and Backside connectivity), BEOL compatible transistors, CMOS platform technologies & opportunities.

Track 7: Device and System Reliability (DSR)

Reliability of devices and systems for biomedical, automotive, and aerospace, Reliability of FEOL/MEOL/BEOL, latch‐up and ESD, Design for reliability and variability-aware design, Robustness and security of electronic circuits and systems, Reliability of cryogenic devices for future quantum computing applications, Noise characterization of device and system, Reliability of biomedical devices, circuits and systems, Degradation mechanisms of emerging memories, Reliability of devices, circuits, and systems for more-than-Moore, reliability of power devices.

Track 8: Optoelectronic Devices and circuits, Displays and Imagers (ODI)

Topological optoelectronics and photonics, Optoelectronic integration, Heterogeneous optoelectronic integration, Single-photon devices, Holographic devices and displays, Luminescent devices-based perovskites and quantum dots, Intelligent Image Sensors, solar cells, Displays, and imagers for augmented or virtual reality, Imagers with an unconventional spectral bandwidth, high sensitivity, or high time-resolution.

Track 9: Sensorand MEMS (SEM)

Bio-sensor, ISFET, Ph Sensor, gas sensors, Flexible devices for wearable applications, Intelligent sensors with embedded AI/ML, Sensors and devices for human-machine interface, MEMS for Internet of Things, Bio-electronic interfaces and implantable devices, Energy harvesting and storage devices, Flexible devices for wearable applications.

Track 10: Intelligent Electronic device, circuit, and System (IDCS)

Devices/ Circuits/systems/ Tools/Platforms for AI, Artificial intelligence computing, Advanced neural network design, Neuromorphic processors, Deep learning algorithms, ML algorithms, Hardware accelerators Hardware design for AI, Emerging applications of AI.

作者指南

After submission, the paper enters into the review process. EDKCON 2022 research papers are reviewed using a single-blind process managed through the Conference portal. A committee of reviewers selected by the Technical Committee will review the documents and rate them according to quality, relevance, correctness, and originality. The review process of research papers for EDKCON 2022 will be a two-round process. Papers are reviewed on the basis that they do not contain plagiarized material and have not been submitted to any other conference at the same time (double submission). In the first round, papers are reviewed independently by a minimum of three members of the conference Technical Program Committee (TPC). No outside reviewing is used for In the first round, papers are reviewed independently by a minimum of three members of the conference Technical Program Committee (TPC). No outside reviewing is used for EDKCON 2022.

Accepted and presented papers will be submitted for inclusion into IEEE Xplore subject to meeting IEEE Xplore’s scope and quality requirements.

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重要日期
  • 会议日期

    11月26日

    2022

    11月27日

    2022

  • 06月15日 2022

    初稿截稿日期

  • 09月15日 2022

    终稿截稿日期

  • 10月15日 2022

    初稿录用通知日期

  • 11月27日 2022

    注册截止日期

主办单位
IEEE Electron Devices Society Kolkata Chapter (EDS)
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