活动简介

About Aerospace; Bioengineering; Components, Circuits, Devices and Systems; Photonics and Electrooptics; Power, Energy and Industry Applications; Transportation
Keywords:electronic packaging,Microelectronics,Thermal management,System in package,embedded technologies,Power electronics,Photonics,Gyroscopes And Microelectromechanical (mems) Sensors,Sensors And Actuators,Semiconductor ,RF microwave packaging,
Scope:The EMPC®2023 Conference will explore microelectronic packaging themes and is seeking research papers, technical presentations and future trends from industrialists and academics.
Sponsor Type:1; 9

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重要日期
  • 会议日期

    09月11日

    2023

    09月14日

    2023

  • 09月14日 2023

    注册截止日期

主办单位
IEEE Electronics Packaging Society
International Microelectronics and Packaging Society Europe - iMAPS Europe
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