活动简介

Pending sponsorship by the ACM Special Interest Group on Design Automation (SIGDA), the IEEE Circuits and Systems Society (CASS) and the IEEE Council on Electronic Design Automation (CEDA). The International Symposium on Low Power Electronics and Design (ISLPED) is the premier forum for presentation of innovative research in all aspects of low power electronics and design, ranging from process technologies and analog/digital circuits, simulation and synthesis tools, system-level design, and optimization, to system software and applications.

组委会

Organizing Committee

General Co-Chairs

  • Helen Li, Duke University

  • Charles Augustine, Intel

Technical Program Co-Chairs

  • Ayse Kivilcim Coskun, Boston University

  • Swaroop Ghosh, Penn State University

Treasurer

  • Weichen Liu

Local Arrangements Chair

  • Ayse Kivilcim Coskun, Boston University

Zoom Arrangements

  • Xiang Chen, GMU

Web/Registration Chair

  • Hiwot Tadese Kassa, UMich

Publications Chair

  • Fan Chen, IU

Design Contest Co-Chairs

  • Kapil Dev, Nvidia

  • Marco Donato, Tufts University

Publicity Chair

  • Linghao Song, UCLA

征稿信息

重要日期

2022-03-11
摘要截稿日期
2022-03-18
初稿截稿日期
2022-05-23
初稿录用日期

征稿范围

1. Technology, Circuits, and Architecture

1.1. Technologies

Low-power technologies for device, interconnect, logic, memory, 2.5/3D, cooling, harvesting, sensors, optical, printable, biomedical, battery, and alternative energy storage devices and technology enablers for non-Boolean and quantum/quantum-inspired compute models.

1.2. Circuits

Low-power circuits for logic, memory, reliability, clocking, resiliency, near-/sub-threshold, and assist schemes; Low-power analog/mixed-signal circuits for wireless, RF, MEMS, AD/DA Converters, I/O, PLLs/DLLS, imaging and DC-DC converters; Energy-efficient circuits for emerging applications (e.g., biomedical, in-vitro sensing, autonomous), circuits using emerging technologies; Cryogenic circuits.

1.3. Logic and Architecture Low-power logic and microarchitecture for SoC designs, processor cores (compute, graphics, and other special purpose cores), cache, memory, arithmetic/signal processing, cryptography, variability, asynchronous design, and non-conventional computing.

2. EDA, Systems, and Software

2.1. CAD Tools and Methodologies

CAD tools and methodologies for low-power and thermalaware design addressing power estimation, optimization, reliability and variation impact on power, and power-down approaches at all levels of design abstraction: physical, circuit, gate, register transfer, behavior, and algorithm.

2.2. Systems and Platforms Low-power, power-aware, and thermal-aware system design including data-center power delivery and cooling, Platforms for SoCs, embedded systems, approximate and brain-inspired computing, Internet-of-Things (IoT), wearable computing, body-area networks, wireless sensor networks, and system-level power implications due to reliability and variability.

2.3. Software and Applications

Energy-efficient, energy-aware, and thermal-aware software and application design including scheduling and management, power optimizations through HW/SW interactions, and emerging software low-power applications.

3. Crosscutting Themes

3.1. AI/ML Hardware Low-power

AI/ML techniques including approximations, application driven optimizations, in-memory/energy-efficient accelerations, and neuromorphic computing; Efficient AI/ML using emerging technologies (including quantum computing).

3.2. Hardware and System

Security Low-power hardware security primitives (PUF, TRNG, cryptographic/post-quantum cryptographic accelerators), nanoelectronics security, supply chain security, IoT security and AI/ML security; Energy-efficient approaches to system security.

4. Industrial Design Track

SLPED’22 solicits papers for an “Industrial Design” track to reinforce interaction between the academic research community and industry. Industrial Design track papers have the same submission deadline as regular papers and should focus on similar topics, but are expected to provide a complementary perspective to academic research by focusing on challenges, solutions, and lessons learnt while implementing industrial-scale designs.

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重要日期
  • 会议日期

    08月01日

    2022

    08月03日

    2022

  • 03月11日 2022

    摘要截稿日期

  • 03月18日 2022

    初稿截稿日期

  • 05月23日 2022

    初稿录用通知日期

  • 08月03日 2022

    注册截止日期

主办单位
Association for Computing Machinery Special Interest Group on Design Automation - ACM SIGDA
IEEE Circuits and Systems Society
IEEE Council on Electronic Design Automation
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