To further promote the technological exchange, industrial chain cooperation and talent training in photonic IC fields, the Chinese Society for Optical Engineering (CSOE), Shandong University and Hisense Broadband plan to hold "the 3rd Forum on Photonic Integrated Circuits", and invite over 200 top-class experts and scholars at home and abroad to discuss the latest progress of integrated photonics technologies and applications. There will also be interesting activities such as PIC training, panel discussions, tutorials, compact exhibtion, talent recruitment and best paper award to provide participants with frontier ideas and cutting-edge information, as well as professional development opportunities for enterprises, scientific researchers, teachers and students.

https://b2b.csoe.org.cn/meeting/FPIC2022_ch.html

Host
Chinese Society for Optical Engineering (CSOE)
Organizers
Shandong University
Hisense Broadband Multimedia Technologies Co., Ltd.
Co-Organizers
National Optoelectronics Innovation Center
Chongqing University

General Chairs
Yueguang Lv, Chinese Academy of Engineering, China
Shaohua Yu, China Information Communication Technologies Group Co., China
Executive Chairs
Weiping Huang, Hisense Broadband, China
Ming Li, Institute of Semiconductors, CAS, China
TPC Chairs
Xinliang Zhang, Huazhong University of Science and Technology, China
Jia Zhao, Shandong University, China
Hua Zhang, Hisense Broadband, China

TPC Co-Chairs
Zhangyuan Chen, Peking University, China
Yikai Su, Shanghai Jiao Tong University, China
Xi Xiao, National Optoelectronics Innovation Center, China
Kun Xu, Beijing University of Posts and Telecommunications, China
Chunlai Xue, Institute of Semiconductors, CAS, China
Jianyi Yang, Zhejiang University, China
Mingbin Yu, SIMIT, China
Li Zeng, Huawei, China
Xiaoping Zheng, Tsinghua University, China
Tao Zhu, Chongqing University, China

Topics

1. Frontier Optoelectronic Devices and Integration
2. Optoelectronic and Microelectronic Integrated Processing
3. Optoelectronic and Microelectronic Integrated Simulation and Design
4. Optoelectronic Integrated Chip Packaging and Testing
5. Optical Transmission and Data Center Application
6. Visible Light Communication
7. Space Laser Communication
8. Smart Optical Computing
9. Optical Quantum Devices and Systems
10. Multidimensional Optical Storage
11. Optical Display
12. Optical Imaging
13. Microwave Photonic Integration
14. Lidar
15. Optical Sensing

Submission

Please submit a 500-600 words abstract for technical review. If accepted, a 4-6 page manuscript can be submitted for publication in the conference proceedings (EI Indexed).
Submission deadline: June 10, 2022

Panels 
1. Large Scale Integrated Chips: Optoelectronic and Microelectronic Fusion
Organizers
SU Yikai, Shanghai Jiao Tong University, China
XIAO Xi, National Optoelectronics Innovation Center, China
Description
Optoelectronic and microelectronic fusion technology is one of the future development trends of optoelectronic integration, which is expected to significantly reduce the size, power consumption and cost of chips. This panel will discuss the specific implementation, processes, performance analysis and potential applications of monolithic photonic integrated chips and other related technologies in response to the challenges in the future.
2. Future Trend of Optical Storage with Logic-in-Memory and Neuromorphic Computing
Organizers
ZHANG Qiming, Shanghai University of Technology, China
LI Xiangping, Jinan University, China
ZHANG Jijun, Hualu Group, China
Description
In the era of Big Data, how to store massive amounts of data in a safe, long-term, and low-cost way has become an important issue. In the past 10 years, AI technology represented by deep learning has profoundly affected human society, but “real intelligence” is still on its way by learning from the human brain’s integration of storage and computing. The technical prospects are promising. This panel will conduct cutting-edge discussions on topics such as phase change memory, deep learning, neuromorphic computing, optical artificial intelligence accelerator, multi-dimensional optical storage, and super-resolution optical storage from the two perspectives of integrating storage and computing.

Tutorials
1. Optical Computing Chips
SHEN Yichen, Lightelligence, China
BAI Bing, Photoncounts, China
2. Key Technologies of Lidar
ZHOU Linjie, Shanghai Jiao Tong Univeristy, China
3. Silicon Photonic Coupling Technology, Principle, Progress and Application
FU Hongyan, Tsinghua Shenzhen International Graduate School, China
4. From F5G to F6G
YE Zhicheng, Huawei, China

PIC Tape-out and Software Training (on site)
Organizers
Shandong University, SIMIT, Hisense Broadband
Description
To deepen young researchers’ understanding of theoretical knowledge and engineering practice of PIC tapeout and software, and improve their professional skills, a two-day training will be held during the conference. Experienced experts will be invited to give lectures on fundamental concepts, practical operation and other skills.
There will be "Elementary class" and "Advanced class" for people with different foundations. The "Elementary class" focuses on the explanation of basic theories and a brief introduction of multiple platforms. The "Advanced class" focuses on the whole process of specific products design. In order to ensure the effectiveness of the training, the number of people in each class will be limited, and the Committee will decide on the final list based on the order of registration and the distribution of organizations.

Compact Exhibition 
PIC materials and devices/simulation and design/process platforms/packaging and testing platforms, optical communication chips and materials/devices and modules/systems/ fiber optic cables, data centers, lidar, optical sensing and imaging, optical storage and display, micro/nano manufacturing platforms, test instruments, production system equipment, etc.

Talent Recruitment
Space for recruitment advertisements will be set up during the meeting. Organizations with recruitment needs may contact the Committee to make an appointment. Both on-site presentation and recruitment table can be provided.