活动简介

Plan now to participate at CSTIC 2022, one of the largest and the most comprehensive annual semiconductor technology conferences in China and Asia since 2000. Organized by SEMI and IEEE-EDS, co-organized by IMECAS, CSTIC 2022 will be held on June 20-21, 2022 in Shanghai, China. Virtual CSTIC conference will be held on June 20-July 15, 2022 on the SEMI Cloud. The conference will have nine symposiums covering all aspects of semiconductor technology with focus on manufacturing and advanced technology, including detailed manufacturing processes, device design, integration, materials, and equipment, as well as emerging semiconductor technologies, circuit design, and silicon material applications. Hot topics, such as artificial intelligence (AI) chips, 6G chips, neuromorphic computing technology, advanced memory technology, 3D integration, MEMS technology will also be addressed in the conference.

组委会

International Advisory Committee Members

 

Dr. T. C. Chen
Chair
IBM Fellow and VP, IBM T.J. Watson Research Center, USA

 

Dr. Minhwa Chi
Co-Chair
SVP/TD, SiEn (Qingdao) Integrated Circuits Co.

 

Dr. Philip Wong
Co-Chair
Professor, Stanford University, USA

 

Dr. Georg Bednorz
Member
IBM Fellow, Nobel Laureate, Switzerland

 

Dr. Qingyuan Han
Member
Hans Consulting International, USA

 

Dr. Kinam KIM
Member
Vice Chairman & CEO, Samsung Electronics, Korea

 

Mrs. Ying Shi
Member
ICMTIA, China

 

Dr. Hailing Tu
Member
GRINM, China

 

Dr. Shichang Zou
Member
Chinese Academy of Sciences, China

 

Dr. Edward Y. Chang
Member
National Chiao Tung University, Taiwan, China

 

Dr. Shaojun WEI
Member
Professor, Tsinghua Universtiy, China

 

Dr. Chenming HU
Member
Professor, UC Berkeley, USA

Steering Committee Advisors

 

Mr. Lung Chu
President,SEMI China
Vice President,SEMI

 

Dr. Hiroshi IWai
Member
NYCU, Taiwan, China

 

Dr. Tomi T. Li
Member
National Taiwan Central University

 

Dr. David P. Huang
Member
Intel, USA

 

Dr. Lode Lauwers
Member
VP, IMEC, Belgium

 

 

Conference Executive Committee Members

 

Dr. Hanming Wu
Conference Chair
Dean of the School of Micro-nano-Electronics, Zhejiang University, China

 

Dr. Beichao Zhang
Symp-IV Chair, Conference Co-Chair, Publicity Chair
AVP, HFC Semiconductor, China

 

Dr. Ru Huang
Symp-I Chair, Conference Co-Chair
Professor and Vice President, Peking University, China

 

Dr. Cor Claeys
Conference Co-Chair and Award Selection Chair
Professor, KU Leuven, Belgium

 

Dr. Linyong (Leo) Pang
Symp-II Chair 
VP, D2S Inc.

 

Dr. Ying ZHANG
Symp-III Chair
VP, Naura, USA

 

Dr. Xinping Qu 
Symp-V Chair
Professor, Fudan University, China

 

Dr. Peilin Song
Symp-VI Chair, Conference Co-Chair, Publicity Chair
Manager, IBM T.J.Watson Research Center, USA

 

Dr. Steve X. Liang
Symp-VII Chair
CEO of JCET Semiconductor (Shaoxing) Co., Ltd., China

 

Dr. Qinghuang Lin
Symp-VIII Chair
Director, Lam Research Corporation, USA

 

Prof. Cheng Zhuo
Symp-IX Chair
Professor, Zhejiang University, China

 

Dr. Hsiang-Lan Lung
Poster Chair
Director MXIC, Taiwan, China

征稿信息

重要日期

2021-10-15
摘要截稿日期
2021-11-15
摘要录用日期
2021-12-26
终稿截稿日期

征稿范围

Scope of Paper Solicited: We aim to provide a platform for executives, managers, engineers and researchers to exchange the latest developments in semiconductor technology. It also offers opportunities for those who are interested in investing and collaboration in the semiconductor industry in Asia, particularly in China. We are soliciting papers from authors around the world on all aspects of semiconductor technology and manufacturing, including device engineering and technology, Front-End-of-Line (FEOL), Back-End-of-Line (BEOL), packaging, metrology and testing, as well as emerging semiconductor technologies and IC design.

Topics to be addressed at CSTIC 2022 include, but are not limited to the following:

Symposium I: Device Engineering and Memory Technology

Symposium II: Lithography and Patterning

Symposium III: Dry & Wet Etch and Cleaning

Symposium IV: Thin Film, Plating and Process Integration

Symposium V: CMP and Post-Polish Cleaning

Symposium VI: Metrology, Reliability and Testing

Symposium VII: Packaging and Assembly

Symposium VIII: MEMS, Sensors and Emerging Semiconductor Technologies

Symposium IX: Design and Automation of Circuits and Systems

留言
验证码 看不清楚,更换一张
全部留言
重要日期
  • 会议日期

    06月20日

    2022

    06月21日

    2022

  • 10月15日 2021

    摘要截稿日期

  • 11月15日 2021

    摘要录用通知日期

  • 12月26日 2021

    终稿截稿日期

  • 06月21日 2022

    注册截止日期

主办单位
IEEE Electron Devices Society
Semiconductor Equipment and Material International Trade Group - SEMI
移动端
在手机上打开
小程序
打开微信小程序
客服
扫码或点此咨询