活动简介
Since the development of Cloud Computing technology has deeply changed not only the development of computer science, but also influenced the way people live. With Cloud-based technology, various kinds of mobile applications to big data based services are provided to accelerate the data oriented services. Today, one of the most promising trends is the Cloud-based solutions for small enterprises to deploy their business on Cloud servers. However, privacy and security issues along with the widely developed Cloud-based services are always becoming an obstacle for the usage of the Cloud services. Also, the Artificial Intelligence (AI) based technologies such as Deep Learning (DL) have brought new challenges to the traditional security and privacy issues on Cloud Computing. IEEE CSCloud 2022 focuses on these two aspects and aims to gather recent achievements in cyber security and cloud computing fields. The conference invites those papers that concentrate on new paradigms, algorithms, and applications in cyber security or cloud computing. We also encourage researchers and practitioners to build up the connections between academia and industry. We aim to collect the latest achievements and exchange research ideas in the domains of intelligent data and security at this academic event.
Joining CSCloud 2022 will be a great opportunity for your to reach academics, professionals, and vendors who have the same research interests as yours. IEEE CSCloud 2022 is the next edition of a series of successful academic events, including CSCloud 2021 (Washington DC, USA), CSCloud 2020 (New York, USA), CSCloud 2019 (Paris, France), CSCloud 2018 (Shanghai, China), CSCloud 2017 (New York, USA), CSCloud 2016 (Beijing, China), CSCloud 2015 (Washington DC, USA), and CSCloud 2014 (Oxford, UK).
The conference proceedings will be submitted to IEEE Xplore.
Sponsor Type:1
组委会
| General Chair |
| Jihe Wang, Northwestern Polytechnical University, China |
| Sun-Yuan Kung, Princeton University, USA |
| Ruqian Lu, Chinese Academy of Sciences | CAS·Academy of Mathematics and Systems Science, China |
| Program Chairs |
| Zakirul Alam, Fordham University, USA |
| Gerard Memmi, Institut Mines-Telecom, France |
| Zhihui Lv, Fudan University, China |
| Steering Committee Chair |
| Meikang Qiu, Texas A&M University Commerce, USA |
| Industry Chair |
| Peng Zhang, SUNY Stony Brook, USA |
| Publicity Chairs |
| Haibo Zhang, University of Otago, New Zealand |
| Yongxin Zhu, Shanghai Advanced Research Institute, Chinese Academy of Sciences, China |
| Hua Huang, Nottingham Trent University, UK |
| Bharat Rawal, Gannon University, USA |
| Local Chairs |
| Xiangyu Gao, New York University, USA |
| Wei Liang, Hunan University, China |
| Web Chair |
| Han Qiu, Tsinghua University, France |
| Technical Program Committee |
| Agostino Cortesi, Università Ca’ Foscari, Italy |
| Alan Dolhasz, Birmingham City University, UK |
| Allan Tomlinson, University of London, United Kingdom |
| Andrew Aftelak, Birmingham City University, UK |
| Bo Luo, The University of Kansas, USA |
| Bo Luo, The University of Kansas, USA |
| Cham Athwal, Birmingham City University, UK |
| Chao-Tung Yang, Tunghai University |
| Cheng Zhang, Waseda University, Japan |
| Chungsik Song, San Jose State University, USA |
| Chunhua Deng, Wuhan University of Science and Technology, China |
| Dalei Wu, University of Tennessee at Chattanooga, USA |
| Dawei Li, Beihang university, China |
| Ding Wang, Peking University, China |
| Ding Wang, Peking University, China |
| Dong Dai, Texas Tech University, USA |
| Emmanuel Bernardez, IBM Research, USA |
| Fausto Spoto, Dipartimento di Informatica, Verona, Italy |
| Fuji Ren, The University of Tokushima, Japan |
| Guangxia Xu, Chongqing University of Posts and Telecommunications, China |
| Haibo Zhang, University of Otago, New Zealand |
| Haibo Zhang, University of Otago, New Zealand |
| Haibo Zhang, University of Otago, New Zealand |
| Hao Hu, Nanjing University, China |
| Hendri Murfi, Universitas Indonesia, Indonesia |
| Hiroyuki Sato, The University of Tokyo, Japan |
| Ian A Williams (CEBE), Birmingham City University, UK |
| Javier Lopez, University of Malaga, Spain |
| Jeremy Foss, Birmingham City University, UK |
| Jeroen van den Bos, Netherlands Forensic Institute, Netherland |
| Jian Zhang, Institute of Software, Chinese Academy of Sciences, China |
| Jian Zhang, Institute of Software, Chinese Academy of Sciences, China |
| Jiaqi Zhu, Chinese Academy of Sciences, China |
| Jin Cheol Kim, KEPCO KDN, Korea |
| Jinguang Gu, Wuhan University of Science and Technology, China |
| Jongpil Jeong, Sungkyunkwan University, South Korea |
| Jue Wang, sccas, China |
| Jun Zheng, New Mexico Tech, USA |
| Junwei Zhang, Xidian University, China |
| Kan Zhang, Tsinghua University, China |
| Kan Zhang, Tsinghua University, China |
| Katie Cover, The Pennsylvania State University, USA |
| Katie Cover, The Pennsylvania State University, USA |
| Ke Miao, Mitacs Inc, Canada |
| Kui Zhang, Birmingham City University, UK |
| Lixin Tao, Pace University, USA |
| Long Fei, Google Inc. USA |
| Long Fei, Google Inc. USA |
| Malik Awan, Cardiff University, UK |
| Malik Awan, Cardiff University, United Kingdom |
| Matthew Roach, Swansea University, UK |
| Meng Ma, Peking University, China |
| Ming Xu, Hangzhou Dianzi University, China |
| Minzhou Pan, Virginia Tech, USA |
| Mohan Muppidi, UTSA, USA |
| Paul Rad, Rackspace, USA |
| Paul Rad, Rackspace, USA |
| Peng Zhang, Stony Brook University, USA |
| Peter Bull, QA Ltd, UK |
| Petr Matousek, Brno University of Technology, Czechia |
| Petr Matousek, Brno University of Technology, Czechia |
| Pietro Ferrara, JuliaSoft SRL, Italy |
| Rehan Bhana, Birmingham City University, UK |
| Ruan He, Tencent Cloud, China |
| Ruisheng Shi, Beijing University of Posts and Telecommunications, China |
| Ruisheng Shi, Beijing University of Posts and Telecommunications, China |
| Sang-Yoon Chang, Advanced Digital Science Center, Singapore |
| Sang-Yoon Chang, Advanced Digital Science Center, Singapore |
| Shaojing Fu, National University of Defense Technology, China |
| Shuangyin Ren, Chinese Academy of Military Science, China |
| Shui Yu, Deakin University, Australia |
| Song Yang, Beijing Institute of Technology, China |
| Songmao Zhang, Chinese Academy of Sciences, China |
| Suman Kumar, Troy University, USA |
| Syed Rizvi, The Pennsylvania State University, USA |
| Wayne Collymore, Birmingham City University, UK |
| Wei Cai, The Chinese University of Hong Kong, Shenzhen, China |
| Wenbo Shi, inha university, South Korea |
| Wenjia Li, New York Institute of Technology, USA |
| William de Souza, University of London, United Kingdom |
| William Glisson, University of South Alabama, USA |
| Xiang He, Birmingham City University, UK |
| Xiaohu Zhou, Birmingham City University, UK |
| Xingfu Wu, Texas A&M University, USA |
| Yaru Fu, Singapore University of Technology and Design, Singapore |
| Yi Zheng, Virginia Tech, USA |
| Yong Zhang, The University of Hong Kong, China |
| Yongxin Zhu, Chinese Academy of Sciences, China |
| Yu Hua, Huazhong University of Science Technology, China |
| Yunxia Liu, Huazhong University of Science and Technology, China |
| Zehua Guo, Beijing Institute of Technology, China |
| Zengpeng Li, Lancaster University, UK |
| Zhiqiang Lin, University of Texas at Dallas, USA |
| Zijian Zhang, Beijing Institute of Technology, China |
| Zongming Fei, University of Kentucky, USA |
征稿信息
重要日期
作者指南
Submissions should include abstract, 5-10 keywords, and the e-mail address of the corresponding author and be in PDF format. Each submission should be in the IEEE 8.5 x 11 inches two-column format with 10-12 point font (Template: DOC or LaTeX), including tables, figures, and references.
Each accepted paper needs at least one author to register in the conference and give an oral presentation at the conference. This process is mandatory for all authors. We assume authors understand this policy before they submit the paper to this conference. For any reasons the authors cannot attend the conference, that will be the authors’ responsibility to take consequences. Any paper withdrawals may result in a punishment given by IEEE CSCloud.
Each submission should be regarded as an undertaking that, should the submission be accepted, at least one of the authors must attend the conference to present the work.
Considering some authors prefer publishing longer papers, we allow authors to submit up to 12 pages (6 complimentary pages and up to 6 extra pages) for regular papers, up to 5 pages (3 complimentary pages and up to 2 extra pages) for short papers/industrial papers, we do not encourage authors to submit overlength papers due to the over length charge. Refer to the following instructions for detailed information contact the over length charge:
PAPER PAGE LIMIT:
- Regular Papers: 6 complimentary pages and up to 6 extra pages, including all figures, tables, and references. (Authors can have 6 complimentary pages. Manuscript can be up to 12 pages with over length charge $150/page)
- Short Papers: 3 complimentary pages and up to 2 extra pages, including all figures, tables, and references. (Authors can have 3 complimentary pages. Manuscript can be up to 5 pages with over length charge $150/page)
- Poster:1 complimentary pages and up to 2 extra pages, including all figures, tables, and references. (Authors can have 1 complimentary pages. Manuscript can be up to 3 pages with over length charge $150/page)
We also encourage the submission of visionary paper and survey paper, which is belong to type 1.
Important Note: Counting the cost of the over length charge uses the longest submission version (e.g. submission version, updated version, camera-ready version). The purpose of this policy is to save reviewers’ time and our operation time.
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重要日期
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会议日期
06月25日
2022
至06月27日
2022
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02月01日 2022
初稿截稿日期
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03月01日 2022
初稿录用通知日期
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06月27日 2022
注册截止日期
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