活动简介

Since the development of Cloud Computing technology has deeply changed not only the development of computer science, but also influenced the way people live. With Cloud-based technology, various kinds of mobile applications to big data based services are provided to accelerate the data oriented services. Today, one of the most promising trends is the Cloud-based solutions for small enterprises to deploy their business on Cloud servers. However, privacy and security issues along with the widely developed Cloud-based services are always becoming an obstacle for the usage of the Cloud services. Also, the Artificial Intelligence (AI) based technologies such as Deep Learning (DL) have brought new challenges to the traditional security and privacy issues on Cloud Computing. IEEE CSCloud 2022 focuses on these two aspects and aims to gather recent achievements in cyber security and cloud computing fields. The conference invites those papers that concentrate on new paradigms, algorithms, and applications in cyber security or cloud computing. We also encourage researchers and practitioners to build up the connections between academia and industry. We aim to collect the latest achievements and exchange research ideas in the domains of intelligent data and security at this academic event.

Joining CSCloud 2022 will be a great opportunity for your to reach academics, professionals, and vendors who have the same research interests as yours. IEEE CSCloud 2022 is the next edition of a series of successful academic events, including CSCloud 2021 (Washington DC, USA), CSCloud 2020 (New York, USA), CSCloud 2019 (Paris, France), CSCloud 2018 (Shanghai, China), CSCloud 2017 (New York, USA), CSCloud 2016 (Beijing, China), CSCloud 2015 (Washington DC, USA), and CSCloud 2014 (Oxford, UK).

The conference proceedings will be submitted to IEEE Xplore.

Sponsor Type:1

组委会
General Chair
Jihe Wang, Northwestern Polytechnical University, China
Sun-Yuan Kung, Princeton University, USA
Ruqian Lu, Chinese Academy of Sciences | CAS·Academy of Mathematics and Systems Science, China
Program Chairs
Zakirul Alam, Fordham University, USA
Gerard Memmi, Institut Mines-Telecom, France
Zhihui Lv, Fudan University, China
Steering Committee Chair
Meikang Qiu, Texas A&M University Commerce, USA
Industry Chair
Peng Zhang, SUNY Stony Brook, USA
Publicity Chairs
Haibo Zhang, University of Otago, New Zealand
Yongxin Zhu, Shanghai Advanced Research Institute, Chinese Academy of Sciences, China
Hua Huang, Nottingham Trent University, UK
Bharat Rawal, Gannon University, USA
Local Chairs
Xiangyu Gao, New York University, USA
Wei Liang, Hunan University, China
Web Chair
Han Qiu, Tsinghua University, France
Technical Program Committee
Agostino Cortesi, Università Ca’ Foscari, Italy
Alan Dolhasz, Birmingham City University, UK
Allan Tomlinson, University of London, United Kingdom
Andrew Aftelak, Birmingham City University, UK
Bo Luo, The University of Kansas, USA
Bo Luo, The University of Kansas, USA
Cham Athwal, Birmingham City University, UK
Chao-Tung Yang, Tunghai University
Cheng Zhang, Waseda University, Japan
Chungsik Song, San Jose State University, USA
Chunhua Deng, Wuhan University of Science and Technology, China
Dalei Wu, University of Tennessee at Chattanooga, USA
Dawei Li, Beihang university, China
Ding Wang, Peking University, China
Ding Wang, Peking University, China
Dong Dai, Texas Tech University, USA
Emmanuel Bernardez, IBM Research, USA
Fausto Spoto, Dipartimento di Informatica, Verona, Italy
Fuji Ren, The University of Tokushima, Japan
Guangxia Xu, Chongqing University of Posts and Telecommunications, China
Haibo Zhang, University of Otago, New Zealand
Haibo Zhang, University of Otago, New Zealand
Haibo Zhang, University of Otago, New Zealand
Hao Hu, Nanjing University, China
Hendri Murfi, Universitas Indonesia, Indonesia
Hiroyuki Sato, The University of Tokyo, Japan
Ian A Williams (CEBE), Birmingham City University, UK
Javier Lopez, University of Malaga, Spain
Jeremy Foss, Birmingham City University, UK
Jeroen van den Bos, Netherlands Forensic Institute, Netherland
Jian Zhang, Institute of Software, Chinese Academy of Sciences, China
Jian Zhang, Institute of Software, Chinese Academy of Sciences, China
Jiaqi Zhu, Chinese Academy of Sciences, China
Jin Cheol Kim, KEPCO KDN, Korea
Jinguang Gu, Wuhan University of Science and Technology, China
Jongpil Jeong, Sungkyunkwan University, South Korea
Jue Wang, sccas, China
Jun Zheng, New Mexico Tech, USA
Junwei Zhang, Xidian University, China
Kan Zhang, Tsinghua University, China
Kan Zhang, Tsinghua University, China
Katie Cover, The Pennsylvania State University, USA
Katie Cover, The Pennsylvania State University, USA
Ke Miao, Mitacs Inc, Canada
Kui Zhang, Birmingham City University, UK
Lixin Tao, Pace University, USA
Long Fei, Google Inc. USA
Long Fei, Google Inc. USA
Malik Awan, Cardiff University, UK
Malik Awan, Cardiff University, United Kingdom
Matthew Roach, Swansea University, UK
Meng Ma, Peking University, China
Ming Xu, Hangzhou Dianzi University, China
Minzhou Pan, Virginia Tech, USA
Mohan Muppidi, UTSA, USA
Paul Rad, Rackspace, USA
Paul Rad, Rackspace, USA
Peng Zhang, Stony Brook University, USA
Peter Bull, QA Ltd, UK
Petr Matousek, Brno University of Technology, Czechia
Petr Matousek, Brno University of Technology, Czechia
Pietro Ferrara, JuliaSoft SRL, Italy
Rehan Bhana, Birmingham City University, UK
Ruan He, Tencent Cloud, China
Ruisheng Shi, Beijing University of Posts and Telecommunications, China
Ruisheng Shi, Beijing University of Posts and Telecommunications, China
Sang-Yoon Chang, Advanced Digital Science Center, Singapore
Sang-Yoon Chang, Advanced Digital Science Center, Singapore
Shaojing Fu, National University of Defense Technology, China
Shuangyin Ren, Chinese Academy of Military Science, China
Shui Yu, Deakin University, Australia
Song Yang, Beijing Institute of Technology, China
Songmao Zhang, Chinese Academy of Sciences, China
Suman Kumar, Troy University, USA
Syed Rizvi, The Pennsylvania State University, USA
Wayne Collymore, Birmingham City University, UK
Wei Cai, The Chinese University of Hong Kong, Shenzhen, China
Wenbo Shi, inha university, South Korea
Wenjia Li, New York Institute of Technology, USA
William de Souza, University of London, United Kingdom
William Glisson, University of South Alabama, USA
Xiang He, Birmingham City University, UK
Xiaohu Zhou, Birmingham City University, UK
Xingfu Wu, Texas A&M University, USA
Yaru Fu, Singapore University of Technology and Design, Singapore
Yi Zheng, Virginia Tech, USA
Yong Zhang, The University of Hong Kong, China
Yongxin Zhu, Chinese Academy of Sciences, China
Yu Hua, Huazhong University of Science Technology, China
Yunxia Liu, Huazhong University of Science and Technology, China
Zehua Guo, Beijing Institute of Technology, China
Zengpeng Li, Lancaster University, UK
Zhiqiang Lin, University of Texas at Dallas, USA
Zijian Zhang, Beijing Institute of Technology, China
Zongming Fei, University of Kentucky, USA
征稿信息

重要日期

2022-02-01
初稿截稿日期
2022-03-01
初稿录用日期

作者指南

Submissions should include abstract, 5-10 keywords, and the e-mail address of the corresponding author and be in PDF format. Each submission should be in the IEEE 8.5 x 11 inches two-column format with 10-12 point font (Template: DOC or LaTeX), including tables, figures, and references.

Each accepted paper needs at least one author to register in the conference and give an oral presentation at the conference. This process is mandatory for all authors. We assume authors understand this policy before they submit the paper to this conference. For any reasons the authors cannot attend the conference, that will be the authors’ responsibility to take consequences. Any paper withdrawals may result in a punishment given by IEEE CSCloud.

Each submission should be regarded as an undertaking that, should the submission be accepted, at least one of the authors must attend the conference to present the work.

Considering some authors prefer publishing longer papers, we allow authors to submit up to 12 pages (6 complimentary pages and up to 6 extra pages) for regular papers, up to 5 pages (3 complimentary pages and up to 2 extra pages) for short papers/industrial papers, we do not encourage authors to submit overlength papers due to the over length charge. Refer to the following instructions for detailed information contact the over length charge:

PAPER PAGE LIMIT:

  • Regular Papers: 6 complimentary pages and up to 6 extra pages, including all figures, tables, and references. (Authors can have 6 complimentary pages. Manuscript can be up to 12 pages with over length charge $150/page)
  • Short Papers: 3 complimentary pages and up to 2 extra pages, including all figures, tables, and references. (Authors can have 3 complimentary pages. Manuscript can be up to 5 pages with over length charge $150/page)
  • Poster:1 complimentary pages and up to 2 extra pages, including all figures, tables, and references. (Authors can have 1 complimentary pages. Manuscript can be up to 3 pages with over length charge $150/page)

We also encourage the submission of visionary paper and survey paper, which is belong to type 1.

Important Note: Counting the cost of the over length charge uses the longest submission version (e.g. submission version, updated version, camera-ready version). The purpose of this policy is to save reviewers’ time and our operation time.

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重要日期
  • 会议日期

    06月25日

    2022

    06月27日

    2022

  • 02月01日 2022

    初稿截稿日期

  • 03月01日 2022

    初稿录用通知日期

  • 06月27日 2022

    注册截止日期

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IEEE Computer Society
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