AboutComponents, Circuits, Devices and Systems; Computing and Processing; Engineered Materials, Dielectrics and Plasmas; Power, Energy and Industry Applications
Keywords:CMOS and foundry technology,embedded memory,low-dimensional materials and devices,Advanced packaging technologies,3D integration,Neuromorphic Computing,Wide Bandgap Semiconductor Power Devices,AI Hardware,Quantum Computing,Advanced Memory Technology ,Hardware Security,Ferroelectric Devices and Memory,Taiwan,Hsinchu.
Scope:Front-end CMOS and foundry technology; Standalone memory: DRAM, FLASH, emerging memory technology; Ultra-low power CMOS and embedded memory; Advanced process modules: e.g. gate stack, junction, strain/channel engineering, low-R contact, low-C spacer/ILD, interconnect technology, ALE and selective deposition, etc.; Nano-patterning: multiple patterning, directed self-Assembly, EUV, etc.; Power and analog IC device and technology; Advanced CMOS process and devices: Ge, SiGe, III-V, FinFET, GAAFET, low-dimensional materials and devices, 2D and nanowire devices; BEOL compatible devices for 3D integration; Material, process and device modeling; Reliability physics, characterization and measurements; Advanced packaging and 2.5D/3D Integration; TFT and organic electronics; MEMS, imagers and sensors; Photonics and beyond CMOS technology; RF & THz process, device and integration technology; Energy harvesting technology; Wearable & loE enabling technologies; Quantum technologies; AI deep learning
Sponsor Type:1; 1; 9