Big data is a rapidly expanding research area spanning the fields of computer science and information management, and has become a ubiquitous term in understanding and solving complex problems in different disciplinary fields such as engineering, applied mathematics, medicine, computational biology, healthcare, social networks, finance, business, government, education, transportation and telecommunications.
The goal of the IEEE 2021 International Conference on Big Data Intelligence and Computing (IEEE DataCom 2021) is to establish an international forum for engineers and scientists to present their ideas and experiences in the fields of Big Data intelligence and computing. IEEE DataCom 2021 welcomes paper submissions on innovative work from researchers in academia, industry and government describing original research work in Big Data.
IEEE DataCom 2021 will be held on October 23-25, 2021, co-located with IEEE SAGC 2021 in Huizhou, Guangdong, China
Shangguang Wang, Beijing University of Posts and Telecommunications, China
Jack Dongarra, Univ of Tennessee, USA
Ao Zhou, Beijing University of Posts and Telecommunications, China
Hui Lei, IBM T. J. Watson Research Center, USA
Mengwei Xu, Beijing University of Posts and Telecommunications, China
Xiao Ma, Beijing University of Posts and Telecommunications, China
Lingyan Zhang, Central South University, China
Sotiris Moschoyiannis, University of Surrey, UK
BBahman Javadi, University of Western Sydney, Australia
Lu Chen, Huizhou University, China
Zhen Wang, Huizhou University, China
Huabin Wang, Huizhou University, China
Tao Xu, Huizhou University, China
Xiaohuan Zhang, Huizhou University, China
Haiyang Yu, Huizhou University, China
Anna Kobusinska, Poznan University of Technology, Poland
Beniamino Di Martino, Second University of Naples, Italy
Christophe Cérin, Université Paris 13, France
Cho-Li Wang, The University of HongKong, Hong Kong
Song Guo, The Hong Kong Polytechnic University, Hong Kong
Wenguang Chen, Tsinghua University, China
Xiaolin Li, University of Florida, USA
Yeh-Ching Chung, The Chinese University of HongKong, Hong Kong
Sanjay Ranka, University of Florida, USA
Robert Hsu, National Chung Cheng University, Taiwan
Manish Parashar, Rutgers University, USA
Hai Jin, HUST, China
Jie Li, University of Tsukuba, Japan
Yuanyuan Yang, Stony Brook University, USA
Authors are invited to submit their original research work that has not previously been submitted or published in any other venue. Papers should be prepared in IEEE CS format and submitted via the IEEE DataCom 2021 web site, https://easychair.org/conferences/?conf=datacom2021
IEEE formatting information: http://www.ieee.org/conferences_events/conferences/publishing/templates.html
Proposals for organizing tutorials, workshops and special sessions need to be submitted to the Tutorials,Workshops and Special Sessions Chairs, respectively. A proposal should include title, theme, scope and main presenters/organizers.
Research paper (8 pages) should explore a specific technology problem and propose a complete solution to it, with experimental results.
Works-in-Progess (WIP) (6 pages) papers are expected to present either work currently in progress or less developed but highly innovative ideas.
Demo/Poster papers (2~4 pages) must describe working systems and be related to DataCom. These systems may be innovative prototype implementations or mature systems that use related technology. Papers/proposals need to be submitted to the Demo/Poster Chair.
Workshop and Special Session papers need to be submitted to the corresponding workshops and special sessions.
Topics of interest include, but are not limited to:
All accepted papers in the main tracks, workshops, special sessions and demos/posters will be published in an IEEE Computer Society proceedings (EI indexed). Extended versions of selected excellent papers will be considered for publication in special issues of prestige journals (SCI/EI indexed).