活动简介

Welcome to the 28th iteration of the IEEE Hot Interconnects symposium. HotI28 will be held August 18-20, 2021.

IEEE Hot Interconnects is the premier international forum for researchers and developers of state of the art hardware and software architectures and implementations for interconnection networks of all scales, ranging from multi-core on-chip interconnects to those within systems, clusters, and data centers. Leaders in industry and academia attend the conference to interact with individuals at the forefront of this field.

Sponsor Type:1

征稿信息

重要日期

2021-05-07
摘要截稿日期
2021-05-14
初稿截稿日期

征稿范围

Topics of Interest (but not limited to these):

Novel and innovative interconnect architectures
Multi-core processor interconnects
System-on-Chip Interconnects
Advanced chip-to-chip communication technologies
Optical interconnects Protocol and interfaces for inter-processor communication
Survivability and fault-tolerance of inter-connects
High-speed packet processing engines and network processors
Systems software for communication
System and storage area network architectures and protocols
High-performance host-network interface architectures
High-bandwidth and low-latency I/O
Pb/s switching and routing technologies
Innovative architectures for supporting collective communication
Novel communication architectures to support cloud & grid computing
Centralized and distributed cloud interconnects
Requirements driving high-performance interconnects
Traffic characterization for HPC systems and commercial data centers
Software-defined networking and software overlay networks
Software for network bring-up, configuration and performance management (OpenFlow, OpenSM)
Data Center Networking

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重要日期
  • 会议日期

    08月18日

    2021

    08月20日

    2021

  • 05月07日 2021

    摘要截稿日期

  • 05月14日 2021

    初稿截稿日期

  • 08月20日 2021

    注册截止日期

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