活动简介

About Components, Circuits, Devices and Systems; Engineered Materials, Dielectrics and Plasmas; Engineering Profession; Photonics and Electrooptics
Keywords:The technical program contains papers covering leading edge developments and technical innovations across the packaging spectrum. Topics include advanced packaging, modeling and simulation, Photonics, interconnections, materials and processing, applied reliability, assembly and manufacturing technology, components and RF, and emerging technologies.,,,
Scope:The Electronic Components and Technology Conference (ECTC) is the premier international event that brings together the best in packaging, components and microelectronic systems science, technology and education in an environment of cooperation and technical exchange. ECTC is sponsored by the IEEE Electronics Packaging Society.
Sponsor Type:1

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重要日期
  • 会议日期

    05月25日

    2026

    05月30日

    2026

  • 05月30日 2026

    注册截止日期

主办单位
IEEE Electronics Packaging Society
承办单位
Institute of Electrical and Electronics Engineers
联系方式
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