活动简介

Welcome to the website of the International Conference on Technical Debt 2021 conference. We are working hard to fill the website with all related information. Please check back soon!

Technical debt describes a universal software development phenomenon: design or implementation constructs that are expedient in the short term but set up a technical context that can make future changes more costly or impossible. Software developers and managers increasingly use the concept to communicate key tradeoffs related to release and quality issues. The goal of this two-day conference is to bring together leading software researchers, practitioners, and tool vendors to explore theoretical and practical techniques that manage technical debt.

The Managing Technical Debt workshop series has provided a forum since 2010 for practitioners and researchers to discuss issues related to technical debt and share emerging practices used in software-development organizations. A week-long Dagstuhl Seminar on Managing Technical Debt in Software Engineering has produced a consensus definition for technical debt, a draft conceptual model, and a research roadmap.

To accelerate progress, an expanded three-day working conference format has become essential. The fourth edition of the TechDebt Conference will be co-located with ICSE 2021 and held virtually (originally in Madrid, Spain) on May 19-21, 2021.

Sponsor Type:1; 9

组委会

Antonio Martini
General Chair
University of Oslo, Norway

Alexander Chatzigeorgiou
Program Co-Chair
University of Macedonia, Greece

Carolyn Seaman
Program Co-Chair
University of Maryland Baltimore County, United States

Marcus Ciolkowski 
Tool Co-Chair
QAware

Valentina Lenarduzzi
Tool Co-Chair
LUT University, Finland

Apostolos Ampatzoglou
Proceedings Chair
University of Macedonia, Greece

Rafael Capilla
Local Co-Chair
Universidad Rey Juan Carlos, Spain

Juan Garbajosa
Publicity Chair
Technical University of Madrid, Spain

Maria Teresa Baldassarre
Virtualisation Chair
Department of Computer Science, University of Bari, Italy

Zadia Codabux
Web Chair
University of Saskatchewan

Daniel Feitosa
Web Chair
University of Groningen, Netherlands

征稿信息

重要日期

2021-02-27
初稿录用日期

征稿范围

Topics of interest include, but are not limited to:

Technical debt management and decision making
Tools and indicators for identifying technical debt
Technical debt in various software domains and development contexts
Novel types of technical debt
Replications and secondary studies of technical debt
Technical debt remediation strategies, methods, and tools
Conceptual frameworks for technical debt
Experiences, approaches and tools for teaching technical debt topics in academic courses or industrial training

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重要日期
  • 会议日期

    05月19日

    2021

    05月21日

    2021

  • 02月27日 2021

    初稿录用通知日期

  • 05月21日 2021

    注册截止日期

主办单位
ACM SIGSOFT/SIGART/SIGPLAN IEEE Computer Society
历届会议
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