The symposium provides state-of-the-art education on EMC, Signal Integrity and Power Integrity design and measurement techniques. The Symposium will feature technical sessions, interactive workshops/tutorials, standards sessions, experiments and demonstrations, virtual technical exhibition and virtual social networking events.
Our flagship educational program, the Clayton R Paul Global University, will take place from the 27 – 29 July. The technical program will focus on tutorials and workshops in the week 2 – 6 August and technical papers in the week 9 – 13 August, with other events throughout these two weeks including our experiments and demonstrations, panel discussions, along with our technical committee and standards committee meetings.
Sponsor Type:1
GENERAL CO-CHAIRS
Alistair Duffy
Bruce Archambeault
VICE CHAIR (EMC EUROPE & TECHNICAL PAPERS)
Dave Thomas
VICE CHAIR (OPERATIONS)
Stephen Scearce
VICE CHAIR (FINANCE)
John LaSalle
VICE SECRETARY
Kris Hatashita
TREASURER/FINANCE CO-CHAIRS
Bob Davis
Linda Dawson
TECHNICAL PROGRAM CO-CHAIRS
Sam Connor
Frank Sabath
Zhiping Yang
SIPI TPC CHAIR
Jun Fan
SPECIAL SESSIONS CO-CHAIRS
Ana Vukovic
Louann Miekodaj
Colin Brench
The IEEE EMC Society’s Technical and Special Committees encompass most but not all of the possible topics of interest. These Committees are responsible for sponsoring Symposium content and reviewing papers within their scope. The Committees, their scopes, and their primary topics of interest are listed below:
TC-1 EMC Management
Personnel & Laboratory Accreditation
EMC Education
Legal Issues
TC-2 EMC Measurements
Test Instrumentation & Facilities
Measurement Techniques
Standards and Regulations
TC-3 EM Environment
EM Signal Environment
Atmospheric & Man-Made Noise
Characterization of the EM environment
TC-4 EM Interference Control
Shielding, Gasketing & Filtering
Cables and Connectors
Circuit & System EMC Analysis
Grounding
PCB Layout
TC-5 High Power Electromagnetics
ESD & Transients
EMP, IEMI & Lightning
Information Leakage
Electric Power EMC
TC-6 Spectrum Engineering
Spectrum characterization and modeling
Design for spectrally efficient systems
Adaptive interference mitigation
TC-7 Low Frequency EMC
Power Quality and Power System EMC
Conducted emissions due to Power Converters
Transportation and Electrical Vehicles
Renewables and Smart Grid
Topics for future standardization
TC-8 Aeronautics and Space EMC
Aircraft
Atmospheric environment
Drones
Spacecraft
Space environment
Launch vehicles
Missiles
Other aerospace topic
TC-9 Computational Electromagnetics
Computer Modeling and Circuit Simulation Methods
Multi-Physics Techniques, Tools and Applications
SI/PI/EMC Co-Simulation
Best Practice and Validation Methods
Surrogate Modeling and Optimization
Techniques
Design of Experiments (DoE) and Statistical Analysis
TC-10 Signal and Power Integrity
High-Speed Interconnects
Device Modeling & Characterization
Crosstalk, Jitter, Noise Coupling, BER Analysis
3D IC & TSV
Power Distribution Networks & Decoupling
SI/PI/EMI Co-Design
Simulation and Modeling Techniques
Chip-level advanced packaging
Topics for future standardization
TC-11 Nanotechnology & Advanced Materials
Nanomaterials & Nanostructures
Smart Materials
Topics for future standardization
TC-12 EMC for Emerging Wireless Technologies
EMC Planning/Testing/Specifications
Wireless Coexistence
Intra-System Interference
RF desense
SC-1 Smart Grid EMC
Renewable Generation
Grid Communications
SC-5 Power Electronics EMC
AC/DC, DC/Dc, DC/AC and AC/DC power conversion
Passive components and semiconductor devices
Automotive, aerospace, and communication systems, wireless power transfer
Medical, aviation, consumer electronics and power applications
Topics for future standardization
07月27日
2021
08月13日
2024
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