The International Symposium on Physical Design provides a premier forum to exchange ideas and promote research on critical areas related to the physical design of VLSI systems. All aspects of physical design, including its interactions with architecture, behavioral and logic-level synthesis, and back-end performance analysis and verification are within the scope of the symposium. Target domains include semi-custom and full-custom ICs, ASICs, FPGAs, and systems-on-chip/systems-in-package. In 2021, the 30th symposium will highlight key new directions and leading-edge theoretical and experimental contributions to the field.
Sponsor Type:1; 9
General Chair
Jens Lienig (Dresden University of Technology)
Steering Committee Chair
William Swartz (TimberWolf Systems and University of Texas at Dallas)
Technical Program Chair
Laleh Behjat (University of Calgary)
Technical Program Chair - Virtual
Stephen Yang (Xilinx)
Publication Chair
David Chinnery (Mentor, a Siemens Business)
Publicity Chair
Iris Hui-Ru Jiang (National Taiwan University)
Finance Chair
Patrick Madden (State University of New York at Binghamton)
Webmaster
Wayne Tung-Wei Lin (University of California, Berkeley)
Topics of interest include but are not limited to:
Floorplanning and interconnect planning
Physical design for emerging technologies
Partitioning, placement, and routing
Hardware security-related physical design
Clock and power networks
Interactions with system and logic level design
Timing and power estimation and modeling
Data management, multi-threaded/distributed algorithms
Design for manufacturability and yield
Circuit analysis in a physical design context
Physical synthesis
Machine learning for physical design
03月21日
2021
03月24日
2021
摘要截稿日期
初稿截稿日期
注册截止日期
2024年03月12日 台湾-中国 Taipei
2024 International Symposium on Physical Design (ISPD)2016年04月03日 美国 Santa Rosa
2016年国际物理设计研讨会2014年03月30日 美国
2014年国际物理设计研讨会
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