活动简介

The International Symposium on Physical Design provides a premier forum to exchange ideas and promote research on critical areas related to the physical design of VLSI systems. All aspects of physical design, including its interactions with architecture, behavioral and logic-level synthesis, and back-end performance analysis and verification are within the scope of the symposium. Target domains include semi-custom and full-custom ICs, ASICs, FPGAs, and systems-on-chip/systems-in-package. In 2021, the 30th symposium will highlight key new directions and leading-edge theoretical and experimental contributions to the field.

Sponsor Type:1; 9

组委会

General Chair    
Jens Lienig (Dresden University of Technology)

Steering Committee Chair    
William Swartz (TimberWolf Systems and University of Texas at Dallas)

Technical Program Chair    
Laleh Behjat (University of Calgary)

Technical Program Chair - Virtual    
Stephen Yang (Xilinx)

Publication Chair    
David Chinnery (Mentor, a Siemens Business)

Publicity Chair    
Iris Hui-Ru Jiang (National Taiwan University)

Finance Chair    
Patrick Madden (State University of New York at Binghamton)

Webmaster    
Wayne Tung-Wei Lin (University of California, Berkeley)

征稿信息

重要日期

2020-10-05
摘要截稿日期
2020-10-15
初稿截稿日期

征稿范围

Topics of interest include but are not limited to:

Floorplanning and interconnect planning 

Physical design for emerging technologies

Partitioning, placement, and routing 

Hardware security-related physical design

Clock and power networks 

Interactions with system and logic level design

Timing and power estimation and modeling 

Data management, multi-threaded/distributed algorithms

Design for manufacturability and yield 

Circuit analysis in a physical design context

Physical synthesis 

Machine learning for physical design

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重要日期
  • 会议日期

    03月21日

    2021

    03月24日

    2021

  • 10月05日 2020

    摘要截稿日期

  • 10月15日 2020

    初稿截稿日期

  • 03月24日 2021

    注册截止日期

主办单位
Association for Computing Machinery Special Interest Group on Design Automation - ACM SIGDA IEEE Council on Electronic Design Automation
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